Semiconductor device and electronic instrument
View Patent ↗A semiconductor device includes a first semiconductor chip, and a second semiconductor chip which includes a high-speed serial I/F circuit which transfers serial data between the high-speed serial I/F circuit and an external device through a serial bus and is stacked on the first semiconductor chip. A pad region in which pads (electrodes) for connecting the external device and the high-speed serial I/F circuit are disposed is provided along a first side of the second semiconductor chip which is the short side. A pad region in which pads for connecting an internal circuit included in the first semiconductor chip and the high-speed serial I/F circuit are disposed is provided along a second side of the second semiconductor chip which is the long side.
1. A semiconductor device comprising:
a serial interface circuit that transfers serial data through a serial bus,
the serial interface circuit including:
a first data transfer circuit;
a clock transfer circuit; and
a second data transfer circuit;
the first data transfer circuit, the clock transfer circuit and the second data transfer circuit being disposed along a first side of the semiconductor device,
the clock transfer circuit being disposed between the first data transfer circuit and the second data transfer circuit,
in a single-channel mode, data being configured to be transferred by the first data transfer circuit, a clock signal being configured to be transferred by the clock transfer circuit, and
in a two-channel mode, the data being configured to be transferred by the first data transfer circuit and the second data transfer circuit, the clock signal being configured to be transferred by the clock transfer circuit.
2. The semiconductor device according to claim 1 ,
the serial interface circuit including a third data transfer circuit,
the first data transfer circuit, the clock transfer circuit, the second data transfer circuit and the third data transfer circuit being disposed along the first side of the semiconductor device,
the second transfer circuit being disposed between the clock transfer circuit and the third data transfer circuit, and
in a three-channel mode, the data being configured to be transferred by the first data transfer circuit, the second data transfer circuit and the third data transfer circuit, the clock signal being configured to be transferred by the clock transfer circuit.
3. The semiconductor device according to claim 1 ,
the serial interface circuit, including a physical layer circuit that transfers data through the serial bus,
the physical layer circuit including:
the first data transfer circuit;
the clock transfer circuit; and
the second data transfer circuit.
4. The semiconductor device according to claim 3 ,
the serial interface circuit including:
a first logic circuit that includes at least one of a parallel/serial conversion circuit that converts parallel data from an internal circuit of the semiconductor device into serial data and a serial/parallel conversion circuit that converts serial data from an external device into parallel data.
5. The semiconductor device according to claim 4 ,
the serial interface circuit including:
a second logic circuit that includes an internal interface circuit that transfers parallel data between the serial interface circuit and the internal circuit of the semiconductor device.
6. The semiconductor device according to claim 1 , further comprising:
a first plurality of electrodes that electrically connect an external device and the serial interface circuit, the first plurality of electrodes being disposed along the first side of the semiconductor device.
7. The semiconductor device according to claim 6 ,
the first plurality of electrodes including:
a first serial-transfer data electrode connected to the first data transfer circuit;
a serial-transfer clock electrode connected to the clock transfer circuit; and
a second serial-transfer data electrode connected to the second data transfer circuit.
8. The semiconductor device according to claim 7 ,
the first serial-transfer data electrode, the serial-transfer clock electrode and the second serial-transfer data electrode being disposed along the first side of the semiconductor device, and
the serial-transfer clock electrode being disposed between the first serial-transfer data electrode and the second serial-transfer data electrode.
9. The semiconductor device according to claim 1 ,
the first side being a short side of the semiconductor device.
10. An electronic instrument comprising:
the semiconductor device according to claim 1 ; and
a display panel that performs a display operation based on data serially transferred by the semiconductor device.