Wiring board, method of manufacturing same, tuner module, and electronic device

1. A wiring board comprising;

a shield layer; and

n layers (n is an integer of two or more) of inductor wiring formed above said shield layer forming an inductor;

wherein of said n layers of inductor wiring, the inductor wiring closest to said shield layer has a smallest wiring area for an innermost wiring coil portion and each subsequent layer has at least one coil portion formed to overlap at least a coil portion of a layer formed directly beneath.

2. The wiring board according to claim 1 ,

wherein the inductor wiring closest to said shield layer has a smallest air-core size.

3. The wiring board according to claim 2 ,

wherein air-core size of said n layers of inductor wiring is set so as to increase gradually as distance from said shield layer is increased.

4. The wiring board according to claim 1 ,

wherein the inductor wiring closest to said shield layer has a narrowest wiring width.

5. A tuner module comprising:

a wiring board including a shield layer and n layers (n is an integer of two or more) of inductor wiring formed above said shield layer and forming an inductor; and

a tuner element mounted on said wiring board in a state of being electrically connected to said n layers of inductor wiring wherein of said n layers of inductor wiring, the inductor wiring closest to said shield layer has a smallest wiring area for an innermost wiring coil portion and each subsequent layer has at least one coil portion formed to overlap at least a coil portion of a layer formed directly beneath.

6. An electronic device using a tuner module comprising:

a wiring board including a shield layer and n layers (n is an integer of two or more) of inductor wiring formed above said shield layer and forming an inductor; and

a tuner element mounted on said wiring board in a state of being electrically connected to said n layers of inductor wiring, wherein of said n layers of inductor wiring, the inductor wiring closest to said shield layer has a smallest wiring area for an innermost wiring coil portion and each subsequent layer has at least one coil portion formed to overlap at least a coil portion of a layer formed directly beneath.

7. A method of manufacturing a wiring board, said method comprising:

when manufacturing the wiring board including a shield layer and n layers (n is an integer of two or more) of inductor wiring formed above said shield layer and forming an inductor,

forming said n layers of inductor wiring such that the inductor wiring closest to said shield layer has a smallest wiring area for an innermost wiring coil portion and each subsequent layer has at least one coil portion formed to overlap at least a coil portion of a layer formed directly beneath.