IP Library Granted Patent US 8,333,456
Granted Patent B2
US 8,333,456 · App. 12/688,895 · Granted Dec 18, 2012

System for printing 3D structure with integrated objects

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Quick Facts
Patent No.
US 8,333,456
App. No.
12/688,895
Granted
Dec 18, 2012
Kind
B2
Abstract

A system for creating a three dimensional printed structure having a plurality of layers. The system includes a plurality of printheads arranged to print voxels of material so as to define respective layers of the structure, a robot for inserting objects into voids created in the structure during printing, and a conveyance for conveying a substrate past the printheads such that the printed structure is created on the substrate.

Claims (22)

1. A system for creating a three dimensional printed structure comprising a plurality of layers, the system comprising:

a plurality of printheads arranged to print voxels of material so as to define respective layers of the structure,

a robot for inserting an object from the supply of objects into voids created in the structure during printing; and

a conveyance for conveying a substrate past the printheads, such that the printed structure is created on the substrate.

2. The system of claim 1 , wherein the printhead are arranged in groups.

3. The system according to claim 2 , wherein the groups are arranged consecutively along a direction of movement of the substrate, with each successive group positioned further from the substrate than a preceding group.

4. The system according to claim 2 , wherein the robot is located between a pair of the groups of printheads.

5. The system according to claim 1 , wherein the system is configured to print at least part of the plurality of layers simultaneously.

6. The system according to claim 1 , wherein at least one first printhead is dedicated to printing a first material and at least one second printhead is dedicated to printing a second material which is different than the first material.

7. The system according to claim 1 , wherein the first material has a different melting temperature than the second material.

8. The system according to claim 1 , wherein the object includes at least one of:

an integrated circuit; and

a semiconductor.

9. The system according to claim 8 , wherein the integrated circuit includes at least one of:

a processor; and

memory.

10. The system according to claim 8 , wherein the semiconductor includes one of:

a transistor;

a light-emitting diode;

a laser diode;

a diode; and

a silicon controller rectifier (SCR).

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Aug 26, 2021
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: 3D SYSTEMS, INC.
Reel/Frame 057651/0374 →
SECURITY INTEREST Recorded Feb 27, 2019
From: 3D SYSTEMS, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 048456/0017 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2013
From: SILVERBROOK RESEARCH PTY LTD
To: 3D SYSTEMS, INC.
Reel/Frame 030404/0275 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2010
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 023800/0187 →