Vertical PCB surface mount inductors and power converters
An vertical PCB inductive device is adapted to be surface mount soldered to a substrate. The inductive device may comprise a transformer having a plurality of windings or one or more discrete inductive devices. The inductive device, being amenable to volume production, may also provide cost savings by reducing the number of layers and the PCB area otherwise required by planar magnetics in a power converter. A power converter may be fashioned to be vertically oriented and surface mount soldered to a substrate such as a customer PCB.
1. Apparatus comprising:
a first generally rectangular multilayer circuit board having a thickness, a length and a width defining a first surface and a second surface generally parallel to the first surface, the first and second surfaces being separated by the thickness, the first circuit board comprising a plurality of conductive layers separated by insulating layers and a plurality of surface contacts arranged along and on the surface of a first edge of the first circuit board, the first edge being defined by the length and the thickness of the first circuit board, wherein the conductive layers include conductive traces such that selected ones of the conductive traces are electrically connected to selected ones of the surface contacts; and
a plurality of components respectively mounted to the first circuit board;
wherein the plurality of surface contacts are configured and arranged to be mechanically and electrically connected to respective conductors on a surface of a second circuit board by surface mount techniques with the first edge proximate and generally parallel to the surface of the second circuit board and the first and second surfaces of the first circuit board generally orthogonal to the surface of the second circuit board.
2. The apparatus of claim 1 wherein the plurality of components comprise semiconductor devices.
3. The apparatus of claim 2 wherein the plurality of components comprise at least one magnetically permeable core and wherein selected ones of the conductive traces form at least one winding magnetically coupled to the magnetic core.
4. The apparatus of claim 3 wherein the first multilayer circuit board and components form a power converter.
5. The apparatus of claim 4 wherein the length and thickness of the first circuit board are chosen relative to the width to provide a mechanically stable base for surface mount soldering the first circuit board to the second circuit board.
6. The apparatus of claim 4 wherein the first edge of the first circuit board and the surface contacts have a width and length that is suitable to surface mount solder the power converter to the second circuit board.