Polycrystalline diamond compacts, method of fabricating same, and various applications
View Patent ↗Embodiments of the invention relate to polycrystalline diamond (“PCD”) exhibiting enhanced diamond-to-diamond bonding. In an embodiment, polycrystalline diamond compact (“PDC”) includes a PCD table having a maximum thickness. At least a portion of the PCD table includes a plurality of diamond grains defining a plurality of interstitial regions. A metal-solvent catalyst occupies at least a portion of the plurality of interstitial regions. The plurality of diamond grains and the metal-solvent catalyst collectively exhibit a coercivity of about 115 Oersteds (“Oe”) or more and a specific magnetic saturation of about 15 Gauss·cm 3 /grams (“G·cm 3 /g”) or less. The PDC includes a substrate having an interfacial surface that is bonded to the PCD table. The interfacial surface exhibits a substantially planar topography. Other embodiments are directed to methods of forming PCD and PDCs, and various applications for such PCD and PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.
1. A polycrystalline diamond compact, comprising:
a polycrystalline diamond table, at least an un-leached portion of the polycrystalline diamond table including,
a plurality of diamond grains defining a plurality of interstitial regions;
a metal-solvent catalyst occupying at least a portion of the plurality of interstitial regions, the metal-solvent catalyst present in an amount of about 1 weight % to about 6 weight %; and
wherein the plurality of diamond grains and the metal-solvent catalyst collectively exhibit a coercivity of about 115 Oersteds (“Oe”) or more and a specific magnetic saturation of about 15 Gauss·cm 3 /grams (“G·cm 3 /g”) or less;
wherein the polycrystalline diamond table exhibits a G ratio of at least about 4.0×10 6 ; and
a substrate including an interfacial surface that is bonded to the polycrystalline diamond table, the interfacial surface exhibiting a substantially planar topography.
2. The polycrystalline diamond compact of claim 1 wherein the interfacial surface comprises a plurality of protrusions, and wherein a ratio of a surface area of the interfacial surface in the absence of the plurality of protrusions to a surface area of the interfacial surface with the plurality of protrusions is greater than about 0.600.
3. The polycrystalline diamond compact of claim 2 wherein the ratio is about 0.600 to about 0.650.
4. The polycrystalline diamond compact of claim 2 wherein the ratio is about 0.650 to about 0.750.
5. The polycrystalline diamond compact of claim 2 wherein the ratio is about 0.750 to less than 1.0.
6. The polycrystalline diamond compact of claim 2 wherein the plurality of protrusions exhibits an average surface relief height, wherein the polycrystalline diamond table exhibits a maximum thickness, and wherein a ratio of the average surface relief height to the maximum thickness is less than about 0.25.
7. The polycrystalline diamond compact of claim 6 wherein the ratio of the average surface relief height to the maximum thickness is about 0.050 to about 0.10.
8. The polycrystalline diamond compact of claim 1 wherein the coercivity is about 155 Oe to about 175 Oe.
9. The polycrystalline diamond compact of claim 1 wherein the coercivity is about 115 Oe to about 250 Oe.
10. The polycrystalline diamond compact of claim 1 wherein the specific magnetic saturation is about 5 G·cm 3 /g to about 15 G·cm 3 /g.
11. The polycrystalline diamond compact of claim 1 wherein the specific magnetic saturation is about 10 G·cm 3 /g to about 15 G·cm 3 /g.
12. The polycrystalline diamond compact of claim 1 wherein the un-leached portion of the polycrystalline diamond table exhibits a specific permeability less than about 0.10.
13. The polycrystalline diamond compact of claim 1 wherein the un-leached portion of the polycrystalline diamond table exhibits a specific permeability of about 0.060 to about 0.090.
14. The polycrystalline diamond compact of claim 1 wherein the coercivity is about 130 Oe to about 160 Oe, and wherein the specific magnetic saturation is about 10 G·cm 3 /g to about 15 G·cm 3 /g.
15. The polycrystalline diamond compact of claim 1 wherein the plurality of diamond grains exhibit an average grain size of about 30 μam or less.
16. The polycrystalline diamond compact of claim 1 wherein the plurality of diamond grains exhibit an average grain size of about 30 μm or less, and wherein the metal-solvent catalyst comprises cobalt, iron, nickel, or alloys thereof.
17. The polycrystalline diamond compact of claim 16 wherein the amount of the metal-solvent catalyst is about 1 weight % to about 3 weight %.
18. The polycrystalline diamond compact of claim 1 wherein the polycrystalline diamond table comprises a first region adjacent to the interfacial surface and a second region remote from the interfacial surface, the first region exhibiting at least one of a composition or an average grain size that is different than that of the second region.
19. The polycrystalline diamond compact of claim 1 wherein the polycrystalline diamond table comprises a working surface exhibiting a residual principal stress of about −345 MPa to about 0 MPa.
20. The polycrystalline diamond compact of claim 1 wherein the G ratio is about 8.0×10 6 to about 15.0×10 6 .
21. The polycrystalline diamond compact of claim 1 wherein the polycrystalline diamond table exhibits a thermal stability thereof as determined by a distance cut prior to failure in a vertical lathe thermal stability test, of at least about 1300 m.
22. The polycrystalline diamond compact of claim 1 wherein the polycrystalline diamond table is integrally formed with the substrate.
23. The polycrystalline diamond compact of claim 1 wherein polycrystalline diamond table comprises a pre-sintered polycrystalline diamond table.
24. The polycrystalline diamond compact of claim 1 wherein the substrate comprises tungsten carbide, chromium carbide, or combinations thereof.
25. The polycrystalline diamond compact of claim 1 wherein the polycrystalline diamond table comprises a leached region, and wherein the at least an un-leached portion of the polycrystalline diamond table is disposed between the substrate and the leached region.
26. The polycrystalline diamond compact of claim 1 wherein the plurality of diamond grains of the at least an un-leached portion of the polycrystalline diamond table exhibits an average grain size of about 10 μm to about 18 μm.
27. The polycrystalline diamond compact of claim 1 wherein the plurality of diamond grains of the at least an un-leached portion of the polycrystalline diamond table exhibits an average grain size of about 20 μm or less.
28. The polycrystalline diamond compact of claim 1 wherein the amount is about 1 weight % to about 3 weight %.
29. The polycrystalline diamond compact of claim 1 wherein the plurality of diamond grains of the at least an un-leached portion of the polycrystalline diamond table exhibits an average grain size of about 20 μm or less, wherein the amount is about 1 weight % to about 3 weight %, and wherein the G ratio is about 8.0×10 6 to about 15.0×10 6 .
30. A rotary drill bit, comprising:
a bit body including a leading end structure configured to facilitate drilling a subterranean formation; and
a plurality cutting elements mounted to the blades, at least one of the cutting elements including,
a polycrystalline diamond table, at least an un-leached portion of the polycrystalline diamond table including,
a plurality of diamond grains defining a plurality of interstitial regions;
a metal-solvent catalyst occupying at least a portion of the plurality of interstitial regions, the metal-solvent catalyst present in an amount of about 1 weight % to about 6 weight %; and
wherein the plurality of diamond grains and the metal-solvent catalyst collectively exhibit a coercivity of about 115 Oersteds (“Oe”) or more and a specific magnetic saturation of about 15 Gauss·cm 3 /grams (“G·cm 3 /g”) or less;
wherein the polycrystalline diamond table exhibits a G ratio of at least about 4.0×10 6 ; and
a substrate including an interfacial surface that is bonded to the polycrystalline diamond table, the interfacial surface exhibiting a substantially planar topography.
31. The rotary drill bit of claim 30 wherein the interfacial surface comprises a plurality of protrusions, and wherein a ratio of a surface area of the interfacial surface in the absence of the plurality of protrusions to a surface area of the interfacial surface with the plurality of protrusions is greater than about 0.600.
32. The rotary drill bit of claim 31 wherein the ratio is about 0.600 to about 0.650.
33. The rotary drill bit of claim 31 wherein the ratio is about 0.650 to about 0.750.
34. The rotary drill bit of claim 31 wherein the ratio is about 0.750 to less than 1.0.
35. The rotary drill bit of claim 31 wherein the plurality of protrusions exhibits an average surface relief height, wherein the polycrystalline diamond table exhibits a maximum thickness, and wherein a ratio of the average surface relief height to the maximum thickness is less than about 0.25.
36. The rotary drill bit of claim 35 wherein the ratio of the average surface relief height to the maximum thickness is about 0.050 to about 0.10.
37. The rotary drill bit of claim 30 wherein the coercivity is about 155 Oe to about 175 Oe.
38. The rotary drill bit of claim 30 wherein the coercivity is about 115 Oe to about 250 Oe.
39. The rotary drill bit of claim 30 wherein the specific magnetic saturation is about 5 G·cm 3 /g to about 15 G·cm 3 /g.
40. The rotary drill bit of claim 30 wherein the specific magnetic saturation is about 10 G·cm 3 /g to about 15 G·cm 3 /g.
41. The rotary drill bit of claim 30 wherein the un-leached portion of the polycrystalline diamond table exhibits a specific permeability less than about 0.10.
42. The rotary drill bit of claim 30 wherein the un-leached portion of the polycrystalline diamond table exhibits a specific permeability of about 0.060 to about 0.090.
43. The rotary drill bit of claim 30 wherein the coercivity is about 130 Oe to about 160 Oe, and wherein the specific magnetic saturation is about 10 G·cm 3 /g to about 15 G·cm 3 /g.
44. The rotary drill bit of claim 30 wherein the plurality of diamond grains exhibit an average grain size of about 30 μm or less.
45. The rotary drill bit of claim 30 wherein the plurality of diamond grains exhibit an average grain size of about 30 μm or less, and wherein the metal-solvent catalyst comprises cobalt, iron, nickel, or alloys thereof.
46. The rotary drill bit of claim 45 wherein the amount of the metal-solvent catalyst is about 1 weight % to about 3 weight %.
47. The rotary drill bit of claim 30 wherein the polycrystalline diamond table comprises a first region adjacent to the interfacial surface and a second region remote from the interfacial surface, the first region exhibiting at least one of a composition or an average grain size that is different than that of the second region.
48. The rotary drill bit of claim 30 wherein the polycrystalline diamond table comprises a working surface exhibiting a residual principal stress of about −345 MPa to about 0 MPa.
49. The rotary drill bit of claim 30 wherein the G ratio is about 8.0×10 6 to about 15.0×10 6 .
50. The rotary drill bit of claim 30 wherein the polycrystalline diamond table exhibits a thermal stability as determined by a distance cut prior to failure in a vertical lathe thermal stability test, of at least about 1300 m.
51. The rotary drill bit of claim 30 wherein the polycrystalline diamond table is integrally formed with the substrate.
52. The rotary drill bit of claim 30 wherein polycrystalline diamond table comprises a pre-sintered polycrystalline diamond table.
53. The rotary drill bit of claim 30 wherein the substrate comprises tungsten carbide, chromium carbide, or combinations thereof.
54. The rotary drill bit of claim 30 wherein the polycrystalline diamond table comprises a leached region, and wherein the at least an un-leached portion of the polycrystalline diamond table is disposed between the substrate and the leached region.
55. The rotary drill bit of claim 30 wherein the plurality of diamond grains of the at least an un-leached portion of the polycrystalline diamond table exhibits an average grain size of about 10 μm to about 18 μm.
56. The rotary drill bit of claim 30 wherein the plurality of diamond grains of the at least an un-leached portion of the polycrystalline diamond table exhibits an average grain size of about 20 μm or less.
57. The rotary drill bit of claim 30 wherein the amount is about 1 weight % to about 3 weight %.
58. The rotary drill bit of claim 30 wherein the plurality of diamond grains of the at least an un-leached portion of the polycrystalline diamond table exhibits an average grain size of about 20 μm or less, wherein the amount is about 1 weight % to about 3 weight %, and wherein the G ratio is about 8.0×10 6 to about 15.0×10 6 .