IP Library Granted Patent US 8,282,740
Granted Patent B2
US 8,282,740 · App. 12/691,492 · Granted Oct 9, 2012

Apparatus, systems and methods for removing debris from a surface

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Quick Facts
Patent No.
US 8,282,740
App. No.
12/691,492
Granted
Oct 9, 2012
Kind
B2
Abstract

Exemplary surface debris removal systems and methods are operable to remove debris from a signal transmitting/receiving surface. An embodiment provides power to, and then removes power from, a conductive memory wire that is secured to a moveable portion of a two-position snap spring. In response to providing the power to the conductive memory wire, a length of the conductive memory wire decreases so that the moveable portion of the two-position snap spring is pulled from an extended position to a retracted position. When power is removed from the conductive memory wire, the moveable portion of the two-position snap spring moves from the retracted position to the extended position. In response to the moving of the moveable portion of the two-position snap spring from the retracted position to the extended position, an energy is generated and transferred to the surface that dislodges the debris from the surface.

Claims (30)

1. A method for debris removal from a surface, the method comprising:

providing power to a conductive memory wire that is secured to a moveable portion of a two-position snap spring,

where in response to providing the power to the conductive memory wire, a length of the conductive memory wire decreases, and

where in response to the decreasing length of the conductive memory wire, the moveable portion of the two-position snap spring is pulled from an extended position to a retracted position; and

removing power from the conductive memory wire,

where in response to removing the power to the conductive memory wire, the moveable portion of the two-position snap spring moves from the retracted position to the extended position, and

where in response to the moving of the moveable portion of the two-position snap spring from the retracted position to the extended position, an energy is generated and transferred to the surface that dislodges the debris from the surface.

2. The method of claim 1 , wherein a heating of a material of the conductive memory wire when the power is provided causes a shrinking of the material, and wherein the shrinking of the material reduces the length of the conductive memory wire.

3. The method of claim 1 , wherein a cooling of a material of the conductive memory wire when the power is not provided causes an expansion of the material, and wherein the expansion of the material increases the length of the conductive memory wire.

4. The method of claim 1 , further comprising:

actuating an actuator to engage a lever arm to push the moveable portion of the two-position snap spring,

wherein the lever arm pushes the moveable portion of the two-position snap spring from the retracted position to the extended position.

5. The method of claim 1 , further comprising:

repeatedly providing and removing the power,

where in response to repeatedly providing and removing the power, the moveable portion of the two-position snap spring repeatedly moves between the retracted position and the extended position, thereby generating a vibratory energy that is transferred to the surface that dislodges the debris.

6. The method of claim 1 , wherein the surface further comprises a surface of a signal transmitting/receiving (STR) device, and the method further comprising:

impacting said surface with the moveable portion of the two-position snap spring, and where in response to the impact of the moveable portion of the two-position snap spring on the STR device, an impact energy is generated that is transferred to the surface that dislodges the debris from the surface of the STR device.

7. The method of claim 1 , further comprising:

sensing an accumulation of the debris on the surface,

where in response to sensing the accumulation of the debris on the surface, the power is provided and removed from the conductive memory wire.

8. The method of claim 1 , further comprising:

periodically generating a signal from a timer,

where in response to generating the signal from the timer, the power is provided and removed from the conductive memory wire.

9. The method of claim 1 , further comprising:

receiving a signal at an interface device,

where in response to receiving the signal at the interface device, the power is provided and removed from the conductive memory wire.

10. The method of claim 3 , wherein increasing the length of the conductive memory wire pushes the moveable portion of the two-position snap spring from the retracted position to the extended position.

11. The method of claim 9 , wherein the signal is generated at a set top box.

12. The method of claim 9 , wherein the signal is generated at a remote device.

13. The method of claim 9 , wherein the signal is generated at a service center.

Assignments (6)
SECURITY INTEREST Recorded Nov 30, 2021
From: DISH BROADCASTING CORPORATION; DISH NETWORK L.L.C.; DISH TECHNOLOGIES L.L.C.
To: U.S. BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058295/0293 →
CHANGE OF NAME Recorded Jun 18, 2018
From: ECHOSTAR TECHNOLOGIES L.L.C.
To: DISH TECHNOLOGIES L.L.C.
Reel/Frame 047264/0127 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2017
From: ECHOSTAR UK HOLDINGS LIMITED
To: ECHOSTAR TECHNOLOGIES INTERNATIONAL CORPORATION
Reel/Frame 041672/0080 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2017
From: ECHOSTAR TECHNOLOGIES INTERNATIONAL CORPORATION
To: ECHOSTAR TECHNOLOGIES L.L.C.
Reel/Frame 041674/0954 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2014
From: ELDON TECHNOLOGY LIMITED
To: ECHOSTAR UK HOLDINGS LIMITED
Reel/Frame 034650/0050 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 21, 2010
From: GOHL, MARK
To: ELDON TECHNOLOGY LIMITED
Reel/Frame 023827/0435 →