Optical proximity sensor package with lead frame
View Patent ↗Various embodiments of an optical proximity sensor having a lead frame and no overlying metal shield are disclosed. In one embodiment, a light emitter and a light detector are mounted on a lead frame comprising a plurality of discrete electrically conductive elements having upper and lower surfaces, at least some of the elements not being electrically connected to one another. An integrated circuit is die-attached to an underside of the lead frame. An optically-transmissive infrared pass compound is molded over the light detector and the light emitter and portions of the lead frame. Next, an optically non-transmissive infrared cut compound is molded over the optically-transmissive infrared pass compound to provide an optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.
1. An optical proximity sensor package, comprising:
a lead frame comprising a plurality of discrete electrically conductive elements having upper and lower surfaces, at least some of the elements not being electrically connected to one another;
an infrared light emitter mounted atop an upper surface of at least a first of the plurality of discrete electrically conductive elements and electrically connected to at least a second of the plurality of discrete electrically conductive elements;
a light detector mounted atop an upper surface of at least a third of the plurality of discrete electrically conductive elements and electrically connected to at least a fourth of the plurality of discrete electrically conductive elements;
an integrated circuit chip mounted to a lower surface of one of the plurality of discrete electrically conductive elements and being mounted at least partially underneath at least one of the infrared light emitter and light detector, the integrated circuit chip comprising light emitter driving and light detecting circuits operably connected to the light emitter and the light detector, respectively;
a first molded infrared light pass component disposed over and covering the light emitter;
a second molded infrared light pass component disposed over and covering the light detector, and a molded infrared light cut component disposed over and between the first and second molded infrared light pass components and over portions of the plurality of discrete electrically conductive elements, the molded infrared light cut component having first and second apertures disposed therethrough above the light emitter and the light detector, respectively;
wherein each of the plurality of discrete electrically conductive elements comprises an outer end extending outwardly from the molded infrared light cut component to form an electrical contact of the package.
2. The optical proximity sensor of claim 1 , wherein at least a first portion of light emitted by the light emitter passes through the first component and the first aperture, and at least a second portion of the first portion of light reflected from an object of interest in proximity to the sensor passes through the second aperture and the second component for detection by the light detector, and the infrared light cut component substantially attenuates or blocks the transmission of undesired direct, scattered or reflected light between the light emitter and the light detector and thereby minimizes optical crosstalk and interference between the light emitter and the light detector.
3. The optical proximity sensor of claim 1 , wherein at least one of the first and second infrared light pass components comprises an optically transmissive epoxy, polymer or plastic.
4. The optical proximity sensor of claim 1 , wherein the infrared light cut component comprises a substantially optically non-transmissive moldable material, epoxy, polymer or plastic.
5. The optical proximity sensor of claim 1 , wherein the infrared light cut component further comprises an infrared cut or blocking additive.
6. The optical proximity sensor of claim 1 , wherein the plurality of discrete electrically conductive elements of the lead frame comprise an electrically conductive metal or metal alloy.
7. The optical proximity sensor of claim 1 , wherein at least one of the light emitter and the light detector is a semiconductor die.
8. The optical proximity sensor of claim 1 , wherein the intergrated circuit chip comprises an application specific integrated circuit (“ASIC”) and the intergrated circuit chip is mounted to the lower surface with an electrically non-conductive epoxy.
9. The optical proximity sensor of claim 1 , wherein the optical proximity sensor is incorporated into a portable electronic device.
10. The optical proximity sensor of claim 9 , wherein the portable electronic device is a smart phone, a mobile telephone, a personal data assistant (PDA), a laptop computer, a notebook computer, or a computer.
11. The optical proximity sensor of claim 1 , wherein the light emitter is an LED.
12. The optical proximity sensor of claim 1 , wherein the light detector is a positive-intrinsic-negative (“PIN”) diode.
13. The optical proximity sensor of claim 1 , wherein a molded optically transmissive lens is formed over at least one of the light emitter and the light detector.
14. A method of making an optical proximity sensor, comprising:
providing a lead frame comprising a plurality of discrete electrically conductive elements having upper and lower surfaces, at least some of the elements not being electrically connected to one another;
mounting an infrared light emitter atop an upper surface of at least a first of the plurality of discrete electrically conductive elements and electrically connecting the infrared light emitter to at least a second of the plurality of discrete electrically conductive elements;
mounting a light detector mounted atop an upper surface of at least a third of the plurality of discrete electrically conductive elements and electrically connecting the light detector to at least a fourth of the plurality of discrete electrically conductive elements;
mounting an integrated circuit chip to a lower surface of one of the plurality of discrete electrically conductive elements such that the intergrated circuit chip at least partially underlies at least one of the infrared light emitter and light detector, the integrated circuit chip comprising light emitter driving and light detecting circuits operably connected to the light emitter and the light detector, respectively;
molding or casting a first infrared light pass component disposed over the light emitter;
molding or casting a second infrared light pass component over the light detector, and molding or casting an infrared light cut component disposed over and between the first and second molded infrared light pass components and over portions of the plurality of discrete electrically conductive elements, the molded infrared light cut component having first and second apertures disposed therethrough above the light emitter and the light detector, respectively;
wherein each of the plurality of discrete electrically conductive elements comprises an outer end extending outwardly from the molded infrared light cut component to form an electrical contact of the package.
15. The method of claim 14 , further comprising configuring the light detector and the light emitter with respect to one another such that at least a first portion of light emitted by the light emitter passes through the first component and the first aperture and at least a second portion of the first portion of light reflected from an object of interest in proximity to the sensor passes through the second aperture for detection by the light detector.
16. The method of claim 14 , further comprising configuring the infrared light cut component to substantially attenuate or block the transmission of undesired direct, scattered or reflected light between the light emitter and the light detector thereby to minimize optical crosstalk and interference between the light emitter and the light detector.
17. The method of claim 14 , further comprising forming optically transmissive lenses over the light emitter and the light detector when the first and second optically transmissive infrared light pass components are molded or casted.
18. The method of claim 14 , wherein the light emitter or the light detector is die-attached to the substrate.
19. The method of claim 14 , wherein the first and second optically transmissive infrared light pass components are casted or transfer-molded.
20. The method of claim 14 , wherein the first and second optically transmissive infrared light pass components are casted or transfer-molded at the same time and later separated by a channel sawn or cut therebetween.
21. The method of claim 14 , further comprising incorporating the optical proximity sensor into a portable electronic device.
22. The method of claim 21 , wherein the portable electronic device is a smart phone, a mobile telephone, a personal data assistant (PDA), a laptop computer, a notebook computer, or a computer.
23. A method of making an optical proximity sensor, comprising:
providing a lead frame along with a backing for the lead frame, the lead frame comprising a plurality of discrete electrically conductive elements having upper and lower surfaces, at least some of the elements not being electrically connected to one another;
mounting an infrared light emitter atop an upper surface of at least a first of the plurality of discrete electrically conductive elements and electrically connecting the infrared light emitter to at least a second of the plurality of discrete electrically conductive elements;
mounting a light detector mounted atop an upper surface of at least a third of the plurality of discrete electrically conductive elements and electrically connecting the light detector to at least a fourth of the plurality of discrete electrically conductive elements;
removing the backing from the lead frame;
after the backing has been removed from the lead frame, adhering an intergrated circuit to a lower surface of one of the plurality of discrete electrically conductive elements such that the intergrated circuit at least partially underlies at least one of the infrared light emitter and light detector, the intergrated circuit comprising light emitter driving and light detecting circuits operably connected to the light emitter and the light detector, respectively;
molding or casting a first infrared light pass component disposed over the light emitter;
molding or casting a second infrared light pass component over the light detector, and molding or casting an infrared light cut component disposed over and between the first and second molded infrared light pass components and over portions of the plurality of discrete electrically conductive elements, the molded infrared light cut component having first and second apertures disposed threrethrough above the light emitter and the light detector, respectively;
wherein each of the plurality of discrete electrically conductive elements comprises an outer end extending outwardly from the molded infrared light cut component to form an electrical contact of the package.
24. The optical proximity sensor of claim 1 , wherein the outer end of each of the plurality of discrete electrically conductive elements extend outwardly from a middle portion of the molded infrared light cut component and wherein the molded infrared light cut component substantially covers the integrated circuit chip that is mounted to the lower surface.