Semiconductor device and manufacturing method thereof
View Patent ↗Provided is a resin sealed semiconductor device including: a semiconductor element; a plurality of micro-balls including an internal terminal surface and an external connection electrode in two sides of the micro-balls; metal wires for electrically connecting the semiconductor element and an internal terminal surface; and a sealing body for sealing the semiconductor element, a part of each the plurality of the terminals, and metal wires with a sealing resin, in which a back surface of the semiconductor element is exposed from the sealing body, and a part of each the plurality of micro-balls are exposed as the external connection electrodes from a bottom surface of the sealing body in a projection manner.
1. A method of manufacturing a resin sealed semiconductor device, comprising:
mounting micro-balls onto a plurality of opening portions formed on a sheet, wherein the micro-balls each comprise a plastic particle core or metal particle core having a metal plating thereon and a spherical perimeter surface, and wherein the plurality of opening portions comprise one of columnar through holes or non-columnar through holes;
mounting a semiconductor element onto a die pad portion of the sheet arranged in a region on a mounting side of the micro-balls except the opening portions;
electrically connecting electrodes of the semiconductor element and the micro-balls with metal wires by forming wire bonds between the metal wires and a portion of the spherical perimeter surface of the metal plating of the micro-balls to couple the metal wire to the spherical perimeter surface;
sealing the mounting side of the semiconductor element with an insulating resin;
removing the sheet from a resin sealing body, thereby exposing a back surface portion of the semiconductor element and lower end portions of the spherical perimeter surface of the metal plating of the micro-balls to provide external connection electrodes; and
separating the sealing body into individual semiconductor devices.
2. A method of manufacturing a resin sealed semiconductor device according to claim 1 , wherein sealing the mounting side of the semiconductor element comprises one-side sealing including completely covering upper end portions of the spherical perimeter surface of the micro-balls with the insulating resin.
3. A method of manufacturing a resin sealed semiconductor device according to claim 1 , wherein the sheet comprises a material selected from the group consisting of: a metal material such as stainless and copper; heat resistance rubber, or heat resistance resin material.
4. A method of manufacturing a resin sealed semiconductor device comprising:
mounting micro-balls onto a plurality of opening portions formed on a sheet;
mounting a semiconductor element onto a die pad portion of the sheet arranged in a region on a mounting side of the micro-balls except the opening portions;
electrically connecting electrodes of the semiconductor element and the micro-balls with metal wires;
sealing the mounting side of the semiconductor element with an insulating resin;
removing the sheet from a resin sealing body, thereby exposing a back surface portion of the semiconductor element and lower end portions of the micro-balls so as to be formed as external connection electrodes; and
separating the sealing body into individual semiconductor devices,
wherein the plurality of opening portions formed in the sheet comprises one of columnar through holes and non-columnar through holes.
5. A method of manufacturing a resin sealed semiconductor device according to claim 1 , wherein the micro-balls comprise a plastic particle core, and the plating comprises gold plating, silver plating, aluminum plating, or nickel plating, and wherein the plating is formed by plating one of a single composition or a multi-layer composition.
6. A method of manufacturing a resin sealed semiconductor device according to claim 1 , wherein the micro-balls comprise a metal particle core comprising copper or nickel, and the metal plating comprises gold plating, silver plating, aluminum plating, or nickel plating, and the metal plating is formed by one of a single composition or a multi-layer composition.
7. A method of manufacturing a resin sealed semiconductor device according to claim 1 , wherein diameters of the micro-balls fall within a range of from 25 μm to 500 μm.
8. A method of manufacturing a resin sealed semiconductor device according to claim 1 , wherein mounting the micro-balls comprises mounting of the micro-balls by a method selected from the group consisting of a mounting method, a sucking method, a squeegee method or vibration of the sheet.
9. A method of manufacturing a resin sealed semiconductor device according to claim 1 , wherein sealing the mounting side comprises one of a potting method and a transfer method, wherein the micro-balls are buried in the insulating resin under a state in which the micro-balls are fixed onto the opening portions of the sheet by one of sucking or through applying an adhesive material.
10. A method of manufacturing a resin sealed semiconductor device according to claim 1 , wherein removing the sheet from the resin sealing body, thereby exposing the semiconductor element and lower end portions of the micro-balls, comprises removing the sheet by a method selected from the group consisting of physical peeling, gliding and polishing using a back gliding device, or wet etching.
11. A method of manufacturing a resin sealed semiconductor device according to claim 1 , wherein separating the sealing body into individual semiconductor devices comprises a dicing method.