Method for manufacturing piezoelectric vibrator, piezoelectric vibrator, and oscillator
The invention provides a method for manufacturing a piezoelectric vibrator, a piezoelectric vibrator, and an oscillator, whereby mounting of the piezoelectric vibrating piece by flip-chip bonding is ensured. A manufacturing method of a piezoelectric vibrator is a method for manufacturing a piezoelectric vibrator that includes: a base substrate; a lid substrate bonded to the base substrate; a piezoelectric vibrating piece including a crystal plate having on its outer surface excitation electrodes, and mount electrodes electrically connected to the excitation electrodes; inner electrodes to be electrically connected to the piezoelectric vibrating piece; and metal bumps to provide electrical interconnections between the inner electrodes and the mount electrodes. The method includes a inner electrodes forming step of forming the inner electrodes, a metal bump forming step of forming the metal bumps, and a mount step of bonding the mount electrodes of the piezoelectric vibrating piece to the metal bumps, wherein, in the mount step, the piezoelectric vibrating piece is mounted and fixed in such a manner that tips of the metal bumps are not in contact with the crystal plate.
1. A method for manufacturing a piezoelectric vibrator that comprises:
a base substrate;
a lid substrate bonded to the base substrate, and that forms a cavity between the base substrate and the lid substrate;
a piezoelectric vibrating piece housed in the cavity, and that includes a crystal plate having on its outer surface excitation electrodes and mount electrodes electrically connected to the excitation electrodes,
wherein the mount electrodes comprise a metal film having a greater thickness than the excitation electrodes;
inner electrodes formed on the base substrate to be electrically connected to the piezoelectric vibrating piece; and
metal bumps formed on the inner electrodes to provide electrical interconnections between the inner electrodes and the mount electrodes, and to mount the piezoelectric vibrating piece in a cantilever fashion,
the method comprising:
forming the inner electrodes on the base substrate;
forming the metal bumps on the inner electrodes; and
bonding the mount electrodes of the piezoelectric vibrating piece to the metal bumps, wherein the piezoelectric vibrating piece is mounted and fixed in such a manner that tips of the metal bumps extend into the mount electrodes in a thickness direction but are not in contact with the crystal plate.
2. The method for manufacturing a piezoelectric vibrator according to claim 1 , wherein the method further comprises etching the crystal plate prior to forming the mount electrodes on the crystal plate.
3. The method for manufacturing a piezoelectric vibrator according to claim 1 ,
wherein an underlying film comprising a conductive material is formed in regions of the crystal plate where the mount electrodes are formed, and the mount electrodes are formed after forming the underlying film, and
wherein, upon bonding of the mount electrodes of the piezoelectric vibrating piece to the metal bumps, the piezoelectric vibrating piece is mounted and fixed in such a manner that the tips of the metal bumps are inside the mount electrodes and away from an interface between the mount electrodes and the underlying film.
4. The method for manufacturing a piezoelectric vibrator according to claim 3 , wherein the underlying film comprises chromium.
5. The method for manufacturing a piezoelectric vibrator according to claim 1 , wherein the metal bumps and the mount electrodes both comprise gold.
6. A piezoelectric vibrator, comprising:
a base substrate;
a lid substrate bonded to the base substrate, and that forms a cavity between the base substrate and the lid substrate;
a piezoelectric vibrating piece housed in the cavity, and that includes a crystal plate having on its outer surface excitation electrodes and mount electrodes electrically connected to the excitation electrodes,
wherein the mount electrodes comprise a metal film having a greater thickness than the excitation electrodes;
inner electrodes formed on the base substrate to be electrically connected to the piezoelectric vibrating piece; and
metal bumps formed on the inner electrodes to provide electrical interconnections between the inner electrodes and the mount electrodes, and to mount the piezoelectric vibrating piece in a cantilever fashion, wherein the metal bumps are mounted and fixed in such a manner that tips of the metal bumps extend into the mount electrodes in a thickness direction but are not in contact with the crystal plate.
7. The piezoelectric vibrator according to claim 6 , further comprising an underlying film comprising a conductive material between the crystal plate and the mount electrodes.
8. The piezoelectric vibrator according to claim 7 , wherein the underlying film comprises chromium.
9. An oscillator, comprising:
a piezoelectric vibrator of claim 6 ; and
an integrated circuit electrically connected to the piezoelectric vibrator provided as a resonator.