Power module for low thermal resistance and method of fabricating the same
View Patent ↗A power module with low thermal resistance buffers the stress put on a substrate during a package molding operation to virtually always prevent a fault in the substrate of the module. The power module includes a substrate, a conductive adhesive layer formed on the substrate, a device layer comprising a support tab, a power device, and a passive device which are formed on the conductive adhesive layer, and a sealing material hermetically sealing the device layer. The support tab is buffers the stress applied by a support pin to the substrate, thereby virtually always preventing a ceramic layer included in the substrate from cracking or breaking. As a result, a reduction in the isolation breakdown voltage of the substrate is virtually always prevented and the failure of the entire power module is do to a reduction in the breakdown voltage of the substrate is virtually always prevented.
1. A method of fabricating a power module for low thermal resistance, the method comprising:
forming an adhesive layer on a substrate using a thermally conductive adhesive;
forming a device layer comprising a power device, a passive device, and a support tab on the adhesive layer;
forming wiring for each of the power device and the passive device in the device layer;
forming a sealing material hermetically sealing the device layer.
2. The method of claim 1 , wherein the device layer is formed using a pick-and-place machine.
3. The method of claim 1 , wherein the sealing material is formed using transfer molding.
4. The method of claim 1 , wherein the support tab is placed between the support pin and the substrate and buffers a stress induced by the support pin virtually always prevents the substrate from breaking.
5. The method of claim 1 , wherein the support tab is formed using a material which acts as a buffer against a mechanical stress induced by the support pin on the substrate.
6. The method of claim 5 , wherein the support tab is formed using a ductile metal.
7. The method of claim 1 , wherein the substrate is formed with a lower copper layer, a ceramic layer, and an upper copper layer and the ceramic layer is formed from at least one material selected from the group consisting of aluminum oxide (Al 2 O 3 ), aluminum nitride (AlN), beryllium oxide (BeO), and silicon nitride (SiN).
8. The method of claim 1 , wherein the adhesive layer is formed using solder and screen printing.