MEMS integrated circuit with polymerized siloxane layer

1. A printhead integrated circuit comprising:

a silicon substrate having a passivated CMOS layer;

a MEMS layer disposed on said passivated CMOS layer, said MEMS layer comprising a plurality of inkjet nozzle assemblies, wherein said CMOS layer comprises drive circuitry for actuating actuator devices associated with said inkjet nozzle assemblies; and

a polymer layer disposed on said MEMS layer, said polymer layer comprising a polymeric material selected from the group consisting of: polymerized siloxanes.

2. The printhead integrated circuit of claim 1 , wherein said MEMS layer comprises a plurality of nozzle chambers, each nozzle chamber having a roof spaced apart from said substrate and sidewalls extending between said roof and said substrate.

3. The printhead integrated circuit of claim 2 , wherein said polymer layer is disposed on each roof.

4. The printhead integrated circuit of claim 2 , wherein said roof and sidewalls are comprised of a same material by virtue of a co-deposition process.

5. The printhead integrated circuit of claim 4 , wherein said roof and sidewalls are comprised of a material selected from the group consisting of: silicon nitride, silicon oxide and silicon oxynitride.

6. The printhead integrated circuit of claim 1 , wherein the polymeric material is comprised of polydimethylsiloxane (PDMS).

7. The printhead integrated circuit of claim 1 , wherein one or more of said actuator devices is a thermal bend actuator, each thermal bend actuator comprising:

an active beam connected to said drive circuitry; and

a passive beam mechanically cooperating with the active beam, such that when a current is passed through the active beam, the active beam expands relative to the passive element, resulting in bending of the actuator.

8. The printhead integrated circuit of claim 7 , wherein each first active element is connected to said drive circuitry via a connector post, each connector post extending linearly between said active beam and said drive circuitry.

9. The printhead integrated circuit of claim 7 , wherein said thermal bend actuator is configured to bend towards said substrate upon actuation.

10. The printhead integrated circuit of claim 1 , wherein a nozzle plate of said printhead integrated circuit has the polymer layer disposed thereon.

11. The printhead integrated circuit of claim 1 , wherein each nozzle assembly comprises: a nozzle chamber, a nozzle opening defined in a roof of the nozzle chamber and an actuator for ejecting ink through the nozzle opening.

12. The printhead integrated circuit of claim 11 , wherein said actuator is a thermal bend actuator comprising:

an active beam connected to said drive circuitry; and

a passive beam mechanically cooperating with the active beam, such that when a current is passed through the active beam, the active beam expands relative to the passive element, resulting in bending of the actuator.

13. The printhead integrated circuit of claim 12 , wherein said thermal bend actuator defines at least part of a roof of each nozzle chamber, whereby actuation of said actuator moves said actuator towards said substrate.

14. The printhead integrated circuit of claim 13 , wherein said nozzle opening is defined in said actuator.

15. The printhead integrated circuit of claim 13 , wherein said polymer layer bridges between said actuator and a stationary portion of said roof, thereby defining a mechanical seal for minimizing ink leakage during actuation.