Method and system for a 60 GHz leaky wave high gain antenna
View Patent ↗Methods and systems for a 60 GHz leaky wave high gain antenna are disclosed and may include communicating RF signals using one or more or more leaky wave antennas (LWAs) in a wireless device. The LWAs may be integrated in metal traces on a chip, a package, and/or a printed circuit board (PCB). The metal traces may supply voltage signals to one or more circuits on the chip, package, and/or PCB. The voltage signals may include DC bias voltages, and/or signals at a frequency that is lower than a resonant frequency of the LWAs. The LWAs may include microstrip or coplanar lines where a cavity height of the LWAs is dependent on a spacing between the lines. An angle of the wireless signals with a surface of the chip, package, and/or PCB may be dynamically configured. The LWAs may be configured via switches in the chip, package, and/or PCB.
1. A method for communication, the method comprising:
communicating RF signals using one or more leaky wave antennas in a wireless device comprising:
a plurality of circuit blocks, each electrically connected to an adjacent circuit block by a plurality of metallic traces; and
said one or more leaky wave antennas utilizing said plurality of metallic traces as a resonance cavity, wherein:
said one or more leaky wave antennas are separate from said plurality of circuit blocks;
said metal traces supply voltage signals between said plurality of circuit blocks.
2. The method according to claim 1 , wherein said voltage signals comprise DC bias voltages.
3. The method according to claim 1 , wherein said voltage signals comprise signals at a frequency that is lower than a resonant frequency of said leaky wave antennas.
4. The method according to claim 1 , wherein said leaky wave antennas comprise microstrip lines.
5. The method according to claim 4 , wherein a cavity height of said leaky wave antennas is dependent on a spacing between said microstrip lines.
6. The method according to claim 1 , wherein said leaky wave antennas comprise coplanar lines.
7. The method according to claim 6 , wherein a cavity height of said leaky wave antennas is dependent on a spacing between said coplanar lines.
8. The method according to claim 1 , wherein said RF signals comprise 60 GHz signals.
9. The method according to claim comprising dynamically configuring an angle of said communicating of said wireless signals with a surface of said chip, said package, and/or said printed circuit board.
10. The method according to claim comprising configuring said one or more leaky wave antennas via switches in said chip, said package, and/or said printed circuit board.
11. A system for enabling communication, the system comprising:
a wireless device comprising:
a plurality of circuit blocks, each electrically connected to an adjacent circuit block by a plurality of metallic traces; and
one or more leaky wave antennas utilizing said plurality of metallic traces as a resonance cavity, wherein:
said one or more leaky wave antennas are separate from said plurality of circuit blocks;
said metal traces supply voltage signals between said plurality of circuit blocks;
said one or more leaky wave antennas being configured to communicate RF signals.
12. The system according to claim 11 , wherein said voltage signals comprise DC bias voltages.
13. The system according to claim 11 , wherein said voltage signals comprise signals at a frequency lower than a resonant frequency of said leaky wave antennas.
14. The system according to claim 11 , wherein said leaky wave antennas comprise microstrip lines.
15. The system according to claim 11 , wherein a cavity height of said leaky wave antennas is dependent on a spacing between said microstrip lines.
16. The system according to claim 11 , wherein said leaky wave antennas comprise coplanar lines.
17. The system according to claim 11 , wherein a cavity height of said leaky wave antennas is dependent on a spacing between said coplanar lines.
18. The system according to claim 11 , wherein said RF signals comprise 60 GHz signals.
19. The system according to claim 11 , wherein said plurality of circuit blocks are configured to dynamically configure an angle of said communicating of said wireless signals with a surface of said chip, package, and/or printed circuit board.
20. The system according to claim 11 , wherein said plurality of circuit blocks are configured to configure said one or more leaky wave antennas via switches in said chip, said package, and/or said printed circuit board.