IP Library Granted Patent US 7,976,117
Granted Patent B2
US 7,976,117 · App. 12/710,340 · Granted Jul 12, 2011

Printhead integrated circuit assembly with compensation controller

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,976,117
App. No.
12/710,340
Granted
Jul 12, 2011
Kind
B2
Abstract

A printhead integrated circuit assembly includes a substrate having a plurality of micro-electromechanical nozzle arrangements formed thereon, each micro-electromechanical nozzle arrangement including a nozzle chamber defined by a crown portion, a skirt portion, and a wall portion; a lever arm included with the micro-electromechanical nozzle arrangement, the lever arm connected at one end to the crown and skirt portions, and at another end to an actuator, the lever arm adapted to move the crown and skirt portions with respect to the wall portion; drive circuitry for supplying a current to the actuator, the current for heating a portion of the actuator to bend the actuator through thermal expansion; containment walls extending from the substrate to surround each micro-electromechanical nozzle arrangement; and a nozzle guard mounted on the containment walls to individually enclose therein, together with the containment walls, each micro-electromechanical nozzle arrangement, the nozzle guard defining therethrough a plurality of apertures aligned with nozzle openings of respective micro-electromechanical nozzle arrangements.

Claims (13)

1. A printhead integrated circuit assembly comprising:

a substrate having a plurality of micro-electromechanical nozzle arrangements formed thereon, each micro-electromechanical nozzle arrangement including a nozzle chamber defined by a crown portion, a skirt portion, and a wall portion;

a lever arm included with the micro-electromechanical nozzle arrangement, the lever arm connected at one end to the crown and skirt portion, and at another end to an actuator, the lever arm adapted to move the crown and skirt portion with respect to the wall portion;

drive circuitry for supplying a current to the actuator, the current for heating a portion of the actuator to bend the actuator through thermal expansion;

containment walls extending from the substrate to surround each micro-electromechanical nozzle arrangement; and

a nozzle guard mounted on the containment walls to individually enclose therein, together with the containment walls, each micro-electromechanical nozzle arrangement, the nozzle guard defining therethrough a plurality of apertures aligned with nozzle openings of respective micro-electromechanical nozzle arrangements.

2. A printhead integrated circuit assembly as claimed in claim 1 , wherein the plurality of apertures of the nozzle guard serve as a collimator for ink drops ejected from respective nozzle openings of the micro-electromechanical nozzle arrangements, the nozzle guard catching ink drops improperly ejected from the plurality of micro-electromechanical nozzle arrangements.

3. A printhead integrated circuit assembly as claimed in claim 2 , wherein each enclosure defined by the containment walls and nozzle guard contains therein ink that is improperly ejected from nozzle chamber.

4. A printhead integrated circuit assembly as claimed in claim 3 , wherein a required supply of current from the drive circuitry to the actuator increases as an amount of ink contained in the enclosure increases.

5. A printhead integrated circuit assembly as claimed in claim 4 , further comprising a controller for monitoring the required supply of current from the drive circuitry to the actuator, wherein the controller is configured to deactivate a micro-electromechanical nozzle arrangement if a required power level is exceeded.

6. A printhead integrated circuit assembly as claimed in claim 5 , wherein the controller is further configured to compensate for the deactivated micro-electromechanical nozzle arrangement using another micro-electromechanical nozzle arrangement.

7. The printhead integrated circuit assembly of claim 1 , wherein the micro-electromechanical nozzle arrangements are hexagonally shaped to allow for close packing of the nozzles on the substrate.

8. The printhead integrated circuit assembly of claim 1 , wherein micro-electromechanical the nozzle arrangements are arranged in staggered rows on the substrate to allow for close packing of the nozzles on the substrate.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028524/0486 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2010
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 023972/0465 →