IP Library Granted Patent US 8,508,315
Granted Patent B2
US 8,508,315 · App. 12/710,626 · Granted Aug 13, 2013

Acoustically coupled resonator filter with impedance transformation ratio controlled by resonant frequency difference between two coupled resonators

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Quick Facts
Patent No.
US 8,508,315
App. No.
12/710,626
Granted
Aug 13, 2013
Kind
B2
Abstract

A signal processing device includes a first acoustic resonator, a second acoustic resonator disposed on the first acoustic resonator, and a coupling layer between the first and the second acoustic resonators. The first acoustic resonator has a first electrical impedance and a first resonance frequency and includes a first set of electrodes, and a first piezoelectric layer having a first thickness, disposed between the first set of electrodes. The second acoustic resonator has a second electrical impedance and a second resonance frequency, and includes a second set of electrodes, and a second piezoelectric layer having a second thickness, wherein the second piezoelectric layer is disposed between the second set of electrodes. The first electrical impedance at a passband frequency of the device substantially differs from the second electrical impedance at the passband frequency of the device. The first and second resonance frequencies are substantially different from each other.

Claims (38)

1. A coupled resonator filter, comprising:

a first film bulk acoustic resonator (FBAR), having a first electrical impedance and a first resonance frequency, the first FBAR comprising:

a first electrode,

a first piezoelectric layer having a first thickness, disposed on the first electrode, and

a second electrode disposed on the first piezoelectric layer;

a second FBAR, having a second electrical impedance and a second resonance frequency, and being disposed over the first FBAR, the second FBAR comprising:

a third electrode,

a second piezoelectric layer having a second thickness, disposed on the third electrode, and

a fourth electrode disposed on the second piezoelectric layer; and a

a coupling layer disposed between the first and the second FBARs,

wherein the first thickness of the first piezoelectric layer is substantially the same as the second thickness of the second piezoelectric layer,

wherein the first and second resonance frequencies are substantially different from each other, and

wherein a thickness of the fourth electrode is substantially different than a thickness of at least one of the first, second, and third electrodes.

2. The filter of claim 1 , wherein the combined thickness of the third and fourth electrodes is substantially less than a combined thickness of the first and second electrodes.

3. The filter of claim 1 , wherein the thickness of the fourth electrode is substantially less than a thickness of at least one of the first, second, and third electrodes.

4. The filter of claim 1 , wherein an electrical impedance of the filter between the first and second electrodes is substantially greater than an electrical impedance of the filter between the third and fourth and second electrodes.

5. The filter of claim 1 , wherein the first electrical impedance at a passband frequency of the device is greater than the second electrical impedance at the passband frequency of the device.

6. A signal processing device, comprising:

a first acoustic resonator, having a first electrical impedance and a first resonance frequency, the first acoustic resonator comprising:

a first set of electrodes, and

a first piezoelectric layer having a first thickness, disposed between the first set of electrodes;

a second acoustic resonator, having a second electrical impedance and a second resonance frequency, and being disposed over the first acoustic resonator, the second acoustic resonator comprising:

a second set of electrodes, and

a second piezoelectric layer having a second thickness that is substantially the same as the first thickness of the first piezoelectric layer, wherein the second piezoelectric layer is disposed between the second set of electrodes; and a

a coupling layer disposed between the first and the second acoustic resonators,

wherein the first electrical impedance at a passband frequency of the device substantially differs from the second electrical impedance at the passband frequency of the device, and

wherein the first and second resonance frequencies are substantially different from each other.

7. The device of claim 6 , wherein at least one of the electrodes of the first set of electrodes has a substantially different thickness than at least one of the electrodes of the second set of electrodes.

8. The device of claim 7 , wherein a top electrode of the first set of electrodes has a substantially different thickness than a corresponding top electrode of the second set of electrodes.

9. The device of claim 8 , wherein the top electrode of the second set of electrodes is substantially thinner than the corresponding top electrode of the first set of electrodes.

10. The device of claim 7 , wherein a top electrode of the second set of electrodes has a substantially different thickness than a bottom electrode of the second set of electrodes.

11. The device of claim 6 , wherein an electrical impedance of the device between the first set of electrodes of the first acoustic resonator is substantially greater than an electrical impedance of the device between the second set of electrodes of the second acoustic resonator.

12. The device of claim 6 , further comprising:

an amplifier having an output connected to at least a first electrode of one of the first and second sets of electrodes; and

an antenna having an input connected to at least a second electrode of the other one of the first and second sets of electrodes.

13. The device of claim 6 , further comprising:

an antenna having an output connected to at least a first electrode of one of the first and second sets of electrodes; and

an amplifier having an input connected to at least a second electrode of the other one of the first and second sets of electrodes.

Assignments (9)
CORRECTIVE ASSIGNMENT TO CORRECT THE ERROR IN RECORDING THE MERGER IN THE INCORRECT US PATENT NO. 8,876,094 PREVIOUSLY RECORDED ON REEL 047351 FRAME 0384. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 8, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 049248/0558 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF THE MERGER PREVIOUSLY RECORDED AT REEL: 047230 FRAME: 0910. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047351/0384 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047230/0910 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
MERGER Recorded May 1, 2013
From: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2010
From: JAMNEALA, TIBERIU; SHIRAKAWA, ALEXANDRE; KOELLE, BERNHARD
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 023977/0960 →