Method and apparatus for mounting and positioning parallel optical transceiver modules in a mid-plane mounting configuration with improved mounting density and alignment accuracy
View Patent ↗An optical communications system is provided in which module locating pins of the system mate with inwardly-shaped corners formed on parallel optical transceiver modules of the system when the parallel optical transceiver modules are mounted on a mid-plane mounting structure of the system. The inwardly-shaped corners of the parallel optical transceiver modules are complementary in shape to portions of the module locating pins. The mating of the module locating pins with the inwardly-shaped corners of the modules operates to passively position the modules at intended spatial locations relative to each other and relative to the mid-plane mounting structure. The inwardly-shaped corners consume very little space in the modules and the pins consume very little space in the optical communications system. Consequently, the pitch between adjacent parallel optical transceiver modules can be kept very small and the mounting density of the modules on the mid-plane mounting structure can be very high.
1. An optical communications system comprising:
a mid-plane mounting structure having a circuit board (CB) mounted on an upper surface thereof;
an array of parallel optical transceiver modules mounted on an upper mounting surface of the CB, each of the transceiver modules having at least one inwardly-shaped corner, wherein each inwardly-shaped corner has a shape that is generally complementary to a shape of a portion of a module locating pin;
a plurality of module locating pins positioned at predetermined positions in the optical communications system, each module locating pin having a shape that is generally complementary to the shape of the inwardly-shaped corners, each of the module locating pins mating with at least one of the inwardly-shaped corners, wherein the mating of the module locating pins and the inwardly-shaped corners operates to precisely position the parallel optical transceiver modules relative to each other and relative to the mid-plane mounting structure; and
an external heat sink device secured to the mid-plane mounting structure such that an upper surface of the external heat sink device generally faces the upper mounting surface of the CB, wherein the module locating pins have first ends that are integrally formed in or secured to an upper surface of the external heat sink device, and wherein the module locating pins have second ends that extend away from the upper surface of the heat sink device in a direction generally normal to the upper surface of the heat sink device and toward the upper mounting surface of the CB, and wherein at least one of the module locating pins mates with one of the inwardly-shaped corners of at least two of the parallel optical transceiver modules.
2. The optical communications system of claim 1 , wherein the module locating pins are generally cylindrical in shape and the inwardly-shaped corners are concave in shape and complementary to the generally cylindrical shape of the module locating pins.
3. The optical communications system of claim 1 , wherein the module locating pins are non-cylindrical in shape and the inwardly-shaped corners have a shape that is complementary to the non-cylindrical shape of the module locating pins.
4. The optical communications system of claim 1 , wherein the mid-plane mounting structure comprises a molded plastic frame, and wherein the CB is mounted on an upper surface of the frame, and wherein the plurality of module locating pins have first ends that are integrally formed in or secured to the upper surface of the frame, and wherein the plurality of module locating pins have second ends that extend away from the upper surface of the frame in a direction generally normal to the upper surface of the frame, and wherein the second ends of the module locating pins pass through the CB and extend in a direction away from the CB and generally normal to the upper mounting surface of the CB, and wherein at least one of the module locating pins mates with one of the inwardly-shaped corners of at least two of the parallel optical transceiver modules.
5. The optical communications system of claim 4 , wherein a first one of the module locating pins mates with one of the inwardly-shaped corners of at least two of the parallel optical transceiver modules, and wherein a second one of the module locating pins mates with one of the inwardly-shaped corners of at least two of the parallel optical transceiver modules.
6. The optical communications system of claim 5 , wherein a first one of the module locating pins mates with one of the inwardly-shaped corners of at least four of the parallel optical transceiver modules, and wherein a second one of the module locating pins mates with one of the inwardly-shaped corners of at least four of the parallel optical transceiver modules.
7. The optical communications system of claim 1 , wherein each parallel optical transceiver module includes at least six transmit channels and at least six receive channels.
8. The optical communications system of claim 1 , wherein a first one of the module locating pins mates with one of the inwardly-shaped corners of at least two of the parallel optical transceiver modules, and wherein a second one of the module locating pins mates with one of the inwardly-shaped corners of at least two of the parallel optical transceiver modules.
9. The optical communications system of claim 8 , wherein a first one of the module locating pins mates with one of the inwardly-shaped corners of at least four of the parallel optical transceiver modules, and wherein a second one of the module locating pins mates with one of the inwardly-shaped corners of at least four of the parallel optical transceiver modules.
10. The optical communications system of claim 1 , wherein each parallel optical transceiver module includes at least six transmit channels and at least six receive channels.
11. A method for positioning a plurality of parallel optical transceiver modules in an optical communications system, the method comprising:
providing a mid-plane mounting structure having a circuit board (CB) mounted on an upper surface thereof;
providing an array of parallel optical transceiver modules mounted on an upper mounting surface of the CB, each of the transceiver modules having at least one inwardly-shaped corner, wherein each shaped corner has a shape that is generally complementary to a shape of a portion of a module locating pin;
providing a plurality of module locating pins positioned at predetermined positions in the optical communications system, each module locating pin having a shape that is generally complementary to the shape of the shaped corners, each of the module locating pins mating with at least one of the shaped corners, wherein the mating of the module locating pins and the shaped corners operates to precisely position the parallel optical transceiver modules relative to each other and relative to the mid-plane mounting structure; and
providing an external heat sink device secured to the raid-plane mounting, structure such that an upper surface of the external heat sink device generally faces the upper mounting surface of the CB, wherein the module locating pins have first ends that are integrally formed in or secured to an upper surface of the external heat sink device, and wherein the module locating pins have second ends that extend away from the upper surface of the heat sink device in a direction generally normal to the upper surface of the heat sink device and toward the upper mounting surface of the CB, and wherein at least one of the module locating pins mates with one of the inwardly-shaped corners of at least two of the parallel optical transceiver modules.
12. The method of claim 11 , wherein the module locating pins are generally cylindrical in shape and the inwardly-shaped corners are concave in shape and complementary to the generally cylindrical shape of the module locating pins.
13. The method of claim 11 , wherein the module locating pins are non-cylindrical in shape and the inwardly-shaped corners have a shape that is complementary to the non-cylindrical shape of the module locating pins.
14. The method of claim 11 , wherein the mid-plane mounting structure comprises a molded plastic frame, and wherein the CB is mounted on an upper surface of the frame, and wherein the plurality of module locating pins have first ends that are integrally formed in or secured to the upper surface of the frame, and wherein the plurality of module locating pins have second ends that extend away from the upper surface of the frame in a direction generally normal to the upper surface of the frame, and wherein the second ends of the module locating pins pass through the CB and extend in a direction away from the CB and generally normal to the upper mounting surface of the CB, and wherein at least one of the module locating pins mates with one of the inwardly-shaped corners of at least two of the parallel optical transceiver modules.
15. The method of claim 14 , wherein a first one of the module locating pins mates with one of the inwardly-shaped corners of at least two of the parallel optical transceiver modules, and wherein a second one of the module locating pins mates with one of the inwardly-shaped corners of at least two of the parallel optical transceiver modules.
16. The method of claim 15 , wherein a first one of the module locating pins mates with one of the inwardly-shaped corners of at least four of the parallel optical transceiver modules, and wherein a second one of the module locating pins mates with one of the inwardly-shaped corners of at least four of the parallel optical transceiver modules.
17. The method of claim 11 , wherein each parallel optical transceiver module includes at least six transmit channels and at least six receive channels.
18. The method of claim 11 , wherein a first one of the module locating pins mates with one of the inwardly-shaped corners of at least two of the parallel optical transceiver modules, and wherein a second one of the module locating pins mates with one of the inwardly-shaped corners of at least two of the parallel optical transceiver modules.
19. The method of claim 18 , wherein a first one of the module locating pins mates with one of the inwardly-shaped corners of at least four of the parallel optical transceiver modules, and wherein a second one of the module locating pins mates with one of the inwardly-shaped corners of at least four of the parallel optical transceiver modules.