IP Library Granted Patent US 8,049,577
Granted Patent B2
US 8,049,577 · App. 12/711,871 · Granted Nov 1, 2011

Elastic wave device, duplexer using the same, and communication apparatus using the duplexer

Assignee: Taiyo Yuden Co., Ltd.
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Quick Facts
Patent No.
US 8,049,577
App. No.
12/711,871
Granted
Nov 1, 2011
Kind
B2
Abstract

An elastic wave device includes resonators having a piezoelectric substrate, a resonation unit formed on the piezoelectric substrate, and reflectors formed on respective sides of the resonation unit on the piezoelectric substrate, and bumps formed on the piezoelectric substrate. The resonators are configured such that two or more split resonators are connected in parallel, and a bump is formed in a region sandwiched between reflectors of the split resonators.

Claims (19)

1. An elastic wave device comprising:

a resonator having a piezoelectric substrate, a resonation unit formed on the piezoelectric substrate, and reflectors formed on respective sides of the resonation unit on the piezoelectric substrate; and

a bump formed on the piezoelectric substrate,

wherein the resonator is configured such that two or more split resonators are connected in parallel, and the bump is formed in a region sandwiched between reflectors of the split resonators and is electrically and acoustically separated from the resonator.

2. The elastic wave device according to claim 1 , having signal wiring connected to the resonation unit,

wherein the bump is surrounded by the signal wiring and the reflectors.

3. The elastic wave device according to claim 1 , wherein the bump is connected to a ground.

4. The elastic wave device according to claim 1 , wherein the bump is connected to external wiring.

5. The elastic wave device according to claim 1 , wherein the split resonators each have the same number of pairs of comb-shaped electrodes.

6. The elastic wave device according to claim 1 , wherein in each of the split resonators, comb-shaped electrodes are formed using the same design.

7. The elastic wave device according to claim 1 , wherein a material of the bump is Au.

8. A filter comprising the elastic wave device according to claim 1 , wherein the elastic wave device includes a plurality of resonators, and the plurality of resonators are connected.

9. A duplexer comprising:

a transmission filter; and

a reception filter having a pass frequency band different from that of the transmission filter,

wherein at least one of the transmission filter and the reception filter is configured using the filter according to claim 8 .

10. A communication apparatus comprising:

an antenna;

the duplexer according to claim 9 that is connected to the antenna; and a signal processing unit connected to the duplexer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2010
From: FUJITSU LIMITED
To: TAIYO YUDEN CO., LTD.
Reel/Frame 024369/0993 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2010
From: MATSUDA, TAKASHI; INOUE, KAZUNORI; MIURA, MICHIO
To: FUJITSU LIMITED
Reel/Frame 023999/0334 →
Continuity (2)
Continuation PCTJP2007072161 · Nov 15, 2007
Related Publication 20100148887A1 · Jun 17, 2010