IP Library Granted Patent US 8,446,729
Granted Patent B2
US 8,446,729 · App. 12/713,349 · Granted May 21, 2013

Modular mass storage system and method therefor

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Quick Facts
Patent No.
US 8,446,729
App. No.
12/713,349
Granted
May 21, 2013
Kind
B2
Abstract

A modular mass storage system and method that enables cableless mounting of ATA and/or similar high speed interface-based mass storage devices in a computer system. The system includes a printed circuit board, a system expansion slot interface on the printed circuit board and comprising power and data pins, a host bus controller on the printed circuit board and electrically connected to the system expansion slot interface, docking connectors connected with the host bus controller to receive power and exchange data therewith and adapted to electrically couple with industry-standard non-volatile memory devices without cabling therebetween, and features on the printed circuit board for securing the memory devices thereto once coupled to the docking connectors.

Claims (18)

1. A mass storage system for a computer system, the mass storage system comprising:

a printed circuit board;

a system expansion slot interface on the printed circuit board and comprising power and data pins;

a host bus controller on the printed circuit board and electrically connected to the system expansion slot interface;

docking connectors adapted to electrically couple with industry-standard non-volatile memory devices without cabling therebetween, the docking connectors being connected with the host bus controller to receive power and exchange data therewith; and

means on the printed circuit board for securing the memory devices thereto once coupled to the docking connectors.

2. The mass storage system according to claim 1 , wherein the system expansion slot interface is a PCIe connector.

3. The mass storage system according to claim 2 , wherein the power and data pins conform to female SATA connectors, eSATA connectors, USB connectors, HDMI connectors, IEEE 1394 interface connectors or SO-DIMM sockets.

4. The mass storage system according to claim 1 , wherein the host bus controller is configured as a RAID controller.

5. The mass storage system according to claim 4 , wherein the host bus controller comprises onboard SDRAM, SRAM or pipeline burst SRAM used as data cache.

6. The mass storage system according to claim 4 , wherein the host bus controller comprises onboard logic capable of carrying out parity calculations for the RAID controller.

7. The mass storage system according to claim 1 , further comprising the memory devices secured to the printed circuit board and coupled to the docking connectors.

8. The mass storage system according to claim 7 , wherein the memory devices comprise at least one solid state drive.

9. The mass storage system according to claim 7 , wherein the memory devices comprise at least one hard disk drive.

10. The mass storage system according to claim 7 , wherein the memory devices comprise at least one USB 3.0 flash drive.

11. The mass storage system according to claim 7 , wherein the memory devices comprise at least one SO-DIMM.

12. The mass storage system according to claim 7 , wherein the memory devices comprise at least two drives chosen from the group consisting of solid state drives, hard disk drives, USB 3.0 flash drives, SO-DIMMs, HDMI drives, and IEEE 1394 interface drives.

13. The mass storage system according to claim 1 , wherein the mass storage system lacks any cables by which the memory devices receive power from and exchange data with a computer motherboard other than through the system expansion slot interface.

Assignments (15)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2017
From: TOSHIBA CORPORATION
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043620/0430 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2016
From: OCZ STORAGE SOLUTIONS, INC.
To: TOSHIBA CORPORATION
Reel/Frame 038434/0371 →
RELEASE OF SECURITY INTEREST BY BANKRUPTCY COURT ORDER (RELEASES REEL/FRAME 030092/0739) Recorded Apr 8, 2014
From: HERCULES TECHNOLOGY GROWTH CAPITAL, INC.
To: OCZ TECHNOLOGY GROUP, INC.
Reel/Frame 032640/0284 →
RELEASE OF SECURITY INTEREST BY BANKRUPTCY COURT ORDER (RELEASES REEL/FRAME 031611/0168) Recorded Apr 8, 2014
From: COLLATERAL AGENTS, LLC
To: OCZ TECHNOLOGY GROUP, INC.
Reel/Frame 032640/0455 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE AND ATTACH A CORRECTED ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED ON REEL 032365 FRAME 0920. ASSIGNOR(S) HEREBY CONFIRMS THE THE CORRECT EXECUTION DATE IS JANUARY 21, 2014. Recorded Mar 18, 2014
From: OCZ TECHNOLOGY GROUP, INC.
To: TAEC ACQUISITION CORP.
Reel/Frame 032461/0486 →
CHANGE OF NAME Recorded Feb 27, 2014
From: TAEC ACQUISITION CORP.
To: OCZ STORAGE SOLUTIONS, INC.
Reel/Frame 032365/0945 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2014
From: OCZ TECHNOLOGY GROUP, INC.
To: TAEC ACQUISITION CORP.
Reel/Frame 032365/0920 →
SECURITY AGREEMENT Recorded Nov 11, 2013
From: OCZ TECHNOLOGY GROUP, INC.
To: COLLATERAL AGENTS, LLC
Reel/Frame 031611/0168 →
SECURITY AGREEMENT Recorded Mar 27, 2013
From: OCZ TECHNOLOGY GROUP, INC.
To: HERCULES TECHNOLOGY GROWTH CAPITAL, INC.
Reel/Frame 030092/0739 →
RELEASE OF SECURITY INTEREST Recorded Mar 26, 2013
From: WELLS FARGO CAPITAL FINANCE, LLC, AS AGENT
To: OCZ TECHNOLOGY GROUP, INC.
Reel/Frame 030088/0443 →
SECURITY AGREEMENT Recorded May 14, 2012
From: OCZ TECHNOLOGY GROUP, INC.
To: WELLS FARGO CAPITAL FINANCE, LLC, AS AGENT
Reel/Frame 028440/0866 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2010
From: SCHUETTE, FRANZ MICHAEL
To: OCZ TECHNOLOGY GROUP, INC.
Reel/Frame 024112/0327 →