IP Library › Patent Application 12714509
Patent Application
App. No. 12/714,509

METHODS FOR MAKING BOARD FOR HAIR CLIP

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Quick Facts
Patent No.
US None
App. No.
12/714,509
Abstract

A method for making a board for a hair clip includes preparing a substrate and a patterned cloth layer. The substrate is made of plastic or metal. The patterned cloth layer is bendable cloth and includes a face with a pattern. The patterned cloth layer is bonded to a surface of the substrate. The substrate with the patterned cloth layer is placed in a mold. A transparent, plastic, outer layer is formed on the substrate by injection molding to cover the patterned cloth layer, obtaining a board for a hair clip. In another method, a substrate made of plastic or metal is prepared. A pattern layer is formed on a face of the substrate. The substrate with the pattern layer is placed in a mold. A transparent, plastic, outer layer is formed on the substrate by injection molding to cover the pattern layer, obtaining a board for a hair clip.

Claims (15)

1 . A method for making a board for a hair clip comprising:

preparing a substrate and a patterned cloth layer, with the substrate being made of plastic or metal, with the patterned cloth layer being bendable cloth and including a face with a pattern;

bonding the patterned cloth layer to a surface of the substrate; and

placing the substrate with the patterned cloth layer in a mold and forming a transparent, plastic, outer layer on the substrate by injection molding, with the outer layer covering the patterned cloth layer, obtaining a board for a hair clip.

2 . The method as claimed in claim 1 , further including: forming a pivotal portion on the outer layer or the substrate.

3 . The method as claimed in claim 3 , with the substrate having a shape corresponding to the board.

4 . The method as claimed in claim 1 , with the substrate having a shape corresponding to a portion of the board.

5 . A method for making a board for a hair clip comprising:

preparing a substrate made of plastic or metal;

forming a pattern layer on a face of the substrate; and

placing the substrate with the pattern layer in a mold and forming a transparent, plastic, outer layer on the substrate by injection molding, with the outer layer covering the pattern layer, obtaining a board for a hair clip.

6 . The method as claimed in claim 5 , with forming the pattern layer including forming the pattern layer on the face of the substrate by transfer printing, spray painting, baking varnish, or gold tooling.

7 . The method as claimed in claim 5 , with the substrate having a shape corresponding to the board.

8 . The method as claimed in claim 5 , with the substrate having a shape corresponding to a portion of the board.

9 . The method as claimed in claim 5 , further including: forming a pivotal portion on the outer layer or the substrate.