Composite substrate, elastic wave device using the same, and method for manufacturing composite substrate
View Patent ↗A composite substrate is provided, including a piezoelectric substrate which is capable of transmitting an elastic wave, and a support substrate, which has a smaller thermal expansion coefficient than that of the piezoelectric substrate, bonded to each other. The in-plane maximum thermal strain amount, which is the largest thermal strain amount in the plane of the composite substrate, has a minimum value and a maximum value when the piezoelectric substrate and the support substrate are relatively rotated 0° to 360°, and the piezoelectric substrate and the support substrate are bonded to each other so that the in-plane maximum thermal strain amount has the minimum value or a value in the vicinity thereof.
1. A composite substrate for a surface acoustic wave device, the composite substrate comprising:
a piezoelectric substrate having anisotropy and which is capable of transmitting an elastic wave; and
a support substrate having anisotropy and having a smaller thermal expansion coefficient than that of the piezoelectric substrate, and which is bonded thereto;
wherein an in-plane maximum thermal strain amount, which is the largest thermal strain amount in the plane of the composite substrate, has a minimum value and a maximum value when the piezoelectric substrate and the support substrate are relatively rotated 0° to 360°; and
wherein an entire surface of one surface of the piezoelectric substrate is bonded with an entire surface of one surface of the support substrate, and the piezoelectric substrate and the support substrate are thereby bonded directly or indirectly via an organic adhesive layer interposed therebetween, to each other so that the in-plane maximum thermal strain amount has the minimum value or a value in the vicinity thereof.
2. The composite substrate according to claim 1 ,
wherein the piezoelectric substrate is made of a material selected from the group consisting of lithium tantalate, lithium niobate, single crystal of lithium niobate-lithium tantalate solid solution, quartz, lithium borate, zinc oxide, aluminum nitride, langasite (LGS), and langatate (LGT); and
wherein the support substrate is made of a material selected from the group consisting of silicon, sapphire, gallium arsenide, gallium nitride, and quartz.
3. An elastic wave device that is produced using the composite substrate according to claim 1 .
4. A composite substrate for a surface acoustic wave device, the composite substrate comprising:
a piezoelectric substrate having anisotropy and which is capable of transmitting an elastic wave; and
a support substrate having anisotropy and having a smaller thermal expansion coefficient than that of the piezoelectric substrate, which is bonded thereto;
wherein an in-plane maximum thermal strain amount, which is the largest thermal strain amount in the plane of the composite substrate, has a minimum value and a maximum value when the piezoelectric substrate and the support substrate are relatively rotated 0° to 360°; and
wherein an entire surface of one surface of the piezoelectric substrate is bonded with an entire surface of one surface of the support substrate, and the piezoelectric substrate and the support substrate are thereby bonded directly or indirect via an organic adhesive layer interposed therebetween, to each other so that the in-plane maximum thermal strain amount is in the range of from the minimum value to a value obtained by reducing the maximum value by 10%.
5. The composite substrate according to claim 4 ,
wherein the piezoelectric substrate is made of a material selected from the group consisting of lithium tantalate, lithium niobate, single crystal of lithium niobate-lithium tantalate solid solution, quartz, lithium borate, zinc oxide, aluminum nitride, langasite (LGS), and langatate (LGT); and
wherein the support substrate is made of a material selected from the group consisting of silicon, sapphire, gallium arsenide, gallium nitride, and quartz.
6. An elastic wave device that is produced using the composite substrate according to claim 4 .
7. A method of manufacturing a composite substrate for a surface acoustic wave device, the method comprising a step of bonding a piezoelectric substrate having anisotropy, and which is capable of transmitting an elastic wave, to a support substrate having anisotropy and having a smaller thermal expansion coefficient than that of the piezoelectric substrate;
wherein an in-plane maximum thermal strain amount of the composite substrate, which is the largest thermal strain amount in the plane of the composite substrate, has a minimum value and a maximum value when the piezoelectric substrate and the support substrate are relatively rotated 0° to 360°; and
wherein an entire surface of one surface of the piezoelectric substrate is bonded with an entire surface of one surface of the support substrate, and the piezoelectric substrate and the support substrate are thereby bonded directly or indirectly via an organic adhesive layer interposed therebetween, to each other so that the in-plane maximum thermal strain amount has the minimum value or a value in the vicinity thereof.