Gravity assisted directed liquid cooling
Dielectric liquid is used to cool heat generating electronic components disposed on a circuit board within a case. The liquid is poured or otherwise directed over the electronic components, with gravity assisting the liquid in flowing downward over the components, with the liquid thereafter being collected in a sump for eventual return back to the electronic components. One exemplary application of the described concepts is in cooling electronic components in computers, for example personal computers or server computers.
1. A liquid cooled electronic device, comprising:
one or more electronic components capable of generating heat disposed in an interior space of a liquid-tight container;
a liquid distribution unit configured to cool at least one of said one or more electronic components by distributing a dielectric liquid to flow in a liquid state over and in direct contact with said at least one electronic component through assistance of gravity so as to absorb heat generated by said at least one electronic component;
a liquid sump beneath the one or more electronic components configured to receive said liquid that flows off said at least one electronic component, the liquid sump is open to and defined by the interior space;
the liquid that flows over the at least one electronic component is in the same state as the liquid in the liquid sump;
a heat exchange unit configured to cool said liquid that is received by said liquid sump; and
a liquid pumping unit configured to pump said liquid received by said liquid sump through said heat exchange unit for cooling of said liquid and to return said liquid back to said liquid distribution unit so as to reuse said liquid for further cooling of said at least one electronic component.
2. The liquid cooled electronic device of claim 1 , wherein the liquid distribution unit comprises a device having an opening for liquid inlet and an opening for liquid outlet and disposed over said at least one electronic component to enclose said at least one electronic component thereby confining the liquid therein as the liquid flows over said at least one electronic component so as to increase contact between the liquid and said at least one electronic component, the device is positioned relative to the at least one electronic component such that liquid exiting the liquid outlet does not flow over the at least one electronic component before the liquid reaches the liquid sump.
3. A method of liquid cooling an electronic component capable of generating heat, comprising:
distributing a dielectric liquid using a liquid distribution device to flow in a liquid state over and in direct contact with said electronic component through assistance of gravity so as to absorb heat generated by said electronic component;
receiving said liquid that flows off said electronic component using a liquid sump disposed beneath said electronic component, the liquid sump is open to and defined by an interior space in which the electronic component is disposed;
the liquid that flows over the electronic component is in the same state as the liquid in the liquid sump;
cooling said liquid received by said liquid sump using a heat exchange device by flowing said liquid through said heat exchange device; and
returning said liquid back to said liquid distribution device using a liquid pumping device so as to reuse said liquid for further cooling of said electronic component.
4. The method of claim 3 , wherein the flow of the liquid over said electronic component is controlled using a device having an opening for liquid inlet and an opening for liquid outlet and disposed over said electronic component to enclose said electronic component thereby confining the liquid therein as the liquid flows over said electronic component so as to increase contact between the liquid and said electronic component, the device is positioned relative to the electronic component such that liquid exiting the liquid outlet does not flow over the electronic component before the liquid reaches the liquid sump.