IP Library Granted Patent US 7,852,544
Granted Patent B2
US 7,852,544 · App. 12/715,220 · Granted Dec 14, 2010

Separable modulator

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Quick Facts
Patent No.
US 7,852,544
App. No.
12/715,220
Granted
Dec 14, 2010
Kind
B2
Abstract

A separable modulator architecture is disclosed. The modulator has a mirror suspended from a flexible layer over a cavity. The flexible layer also forms supports and support posts for the mirror. An alternative separable modulator architecture has a mirror suspended over a cavity. The modulator is supported by supports and support posts. The support posts comprise a flexible layer over support post plugs. A bus structure may be formed upon the flexible layer arranged over the support posts.

Claims (26)

1. An electromechanical device comprising:

a first optical stack located over a substrate and comprising a first electrode;

a second optical stack located adjacent the first optical stack and comprising a second electrode;

a first movable mirror spaced apart from the first optical stack by a first cavity, said first movable mirror having a reflective surface facing the first cavity;

a second movable mirror spaced apart from the second optical stack by a second cavity, said second movable mirror having a reflective surface facing the second cavity; and

a flexible layer located over the first and second movable mirrors and supporting the first and second movable mirrors, wherein the first and second movable mirrors are in electrical communication with one another, and wherein at least a portion of the first and second mirrors are physically separated from one another.

2. The device of claim 1 , wherein at least a portion of the flexible layer is spaced apart from at least a portion of the first and second movable mirrors.

3. The device of claim 1 , additionally comprising a plurality of support posts located over the substrate, wherein the flexible layer is supported by said plurality of support posts.

4. The device of claim 3 , wherein the plurality of support posts comprise a portion of the flexible layer.

5. The device of claim 3 , additionally comprising at least one bus structure located over at least one of the plurality of support posts.

6. The device of claim 3 , wherein the plurality of support posts comprise a planarizing material.

7. The device of claim 1 , wherein the flexible layer is in contact with the first movable mirror at more than one location.

8. The device of claim 1 , wherein the optical stack comprises a metal layer.

9. The device of claim 1 , wherein the first cavity has a first height, and wherein the second cavity has a second height which is different than the first height of the first cavity.

10. The device of claim 1 , wherein the first electrode and the second electrode are electrically isolated from one another.

11. A method of manufacturing an electromechanical device, comprising:

forming first and second optical stacks over a substrate, wherein said first optical stack comprises a first electrode, and wherein said second optical stack comprises a second electrode;

depositing a first sacrificial layer over the first and second optical stacks;

forming a first mirror over the first optical stack and a second mirror over the second optical stack, wherein at least a portion of the first and second mirrors are physically separated from one another;

forming a flexible layer over the first and second mirrors, wherein the flexible layer is in contact with at least a portion of each of the first and second mirrors; and

removing the sacrificial layer.

12. The method of claim 11 , further comprising:

forming a second sacrificial layer over the first and second mirrors prior to forming the flexible layers; and

patterning the second sacrificial layer to expose a portion of the first and second mirrors.

13. The method of claim 11 , wherein the optical stack comprises a metal layer.

14. The method of claim 11 , wherein depositing a first sacrificial layer comprises depositing a first sacrificial layer having multiple thicknesses, wherein the portion of the first sacrificial layer underlying the first mirror has a first thickness, and wherein the portion of the first sacrificial layer underlying the second mirror has a second thickness.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 31, 2016
From: QUALCOMM MEMS TECHNOLOGIES, INC.
To: SNAPTRACK, INC.
Reel/Frame 039891/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2010
From: SAMPSELL, JEFFREY B.; MILES, MARK W.; CHUI, CLARENCE; KOTHARI, MANISH
To: IRIDIGM DISPLAY CORPORATION
Reel/Frame 024519/0737 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2010
From: IRIDIGM DISPLAY CORPORATION
To: IDC, LLC
Reel/Frame 024519/0764 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2010
From: IDC, LLC
To: QUALCOMM MEMS TECHNOLOGIES, INC.
Reel/Frame 024519/0915 →