HEAT SINK BUCKLE
A heat sink buckle is provided. The heat sink buckle includes a frame and a side plate. The frame includes a plurality of frame sides. The side plate is substantially perpendicular with the frame, and is configured extending from one of the frame sides. A central portion of the side plate is jointly connected to the frame side. The side plate includes a pressing member and a fixing member. The pressing member is positionally higher than the frame side and the fixing member is positionally lower than the frame side. The fixing member has an inner side surface. The fixing member includes a clasp extruded from a bottom edge of the inner side surface of the fixing member. When the pressing member is inwardly pressed, the fixing member is outwardly widened, and when the pressing member is released, the fixing member recovers to the original position.
1 . A heat sink buckle, adapted for locking a heat sink onto a chipset, comprising:
a frame comprising a plurality of frame sides; and
at least one side plate being substantially perpendicular with the frame and configured extending from one of the frame sides, wherein a central portion of the side plate is jointly connected to the frame side, wherein the side plate comprises:
a pressing member, positionally higher than the frame; and
a fixing member, positionally lower than the frame, wherein the fixing member has an inner side surface, and the fixing member comprises a clasp extruded from a bottom edge of the inner side surface of the fixing member.
2 . The heat sink buckle as claimed in claim 1 , wherein the frame has a shape corresponding to a shape of the heat sink or corresponding to a shape of the chipset.