Method and apparatus for bonding metals and composites
View Patent ↗Apparatus, systems and methods for forming a structure that includes a metal and a composite material are disclosed. According to one aspect, a layer stack includes a metal layer with a first surface, the first surface including at least one protruding feature. The layer stack also includes a non-metal layer molded to the first surface of the metal layer, wherein the non-metal layer is molded over and/or around the at least one protruding feature.
1. An assembly comprising:
a substrate arrangement, the substrate arrangement including:
a metal substrate; and
a prongle layer, the prongle layer having a first base surface and a second base surface, the first base surface coupled to a top surface of the metal substrate, the second base surface including at least one protruding feature integral with the layer; and
a non-metal layer, the non-metal layer being formed over the at least one protruding feature, wherein the non-metal layer engages the at least one protruding feature.
2. The assembly of claim 1 , wherein the non-metal layer formed over the at least one protruding feature is molded over the at least one protruding feature.
3. The assembly of claim 1 , wherein the prongle layer is molded onto the metal substrate.
4. The assembly of claim 1 , wherein the prongle layer is bonded to the metal substrate.
5. The assembly of claim 1 , wherein the at least one protruding feature is a wire, the wire being attached to the substrate arrangement.
6. The assembly of claim 5 , wherein the wire is attached to the substrate arrangement through a wire bond.
7. The assembly of claim 1 , wherein the at least one protruding feature is a solder ball.
8. The assembly of claim 1 , wherein the prongle layer is formed from a metal material and the non-metal layer is a composite layer.
9. The assembly of claim 8 , wherein the composite layer is formed from a thermoplastic material.
10. The assembly of claim 1 , wherein the assembly comprises at least a portion of an electronic device.
11. The assembly of claim 10 ,
wherein the substrate arrangement comprises a bezel, the bezel including at least one flange with a first surface, and
wherein the first surface of the flange has the at least one protruding feature formed thereon and extending therefrom.
12. The assembly of claim 11 , wherein the non-metal layer is a composite component, and wherein the composite component is formed over the at least one protruding feature and the flange,
13. The assembly of claim 10 , wherein the composite component engages the least one protruding feature and the flange to engage the bezel.
14. The assembly of claim 10 , wherein the bezel is formed from a metal materia
15. The assembly of claim 10 , wherein the composite component is a thermoplastic component.
16. The assembly of claim 10 , wherein the at least one protruding feature is integrally formed on or bonded to the flange.
17. The assembly of claim 10 , wherein the at least one protruding feature is bonded to the flange by being molded onto the flange.
18. The assembly of claim 10 , wherein the at least one protruding feature includes a wire bonded to the flange.
19. The assembly of claim 10 , wherein the at least one protruding feature includes a solder ball.