IP Library Granted Patent US 8,365,846
Granted Patent B2
US 8,365,846 · App. 12/716,251 · Granted Feb 5, 2013

Polycrystalline diamond cutter with high thermal conductivity

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Quick Facts
Patent No.
US 8,365,846
App. No.
12/716,251
Granted
Feb 5, 2013
Kind
B2
Abstract

A front face of a diamond table mounted to a substrate is processed to introduce a material which comingles with or semi-alloys with or partially displaces interstitial catalyst binder in a thermal channel to a desired depth. The material is selected to be less thermally expandable than the catalyst binder and/or more thermally conductive than the catalyst binder and/or having a lower heat capacity than the catalyst binder.

Claims (44)

1. A polycrystalline diamond compact (PDC) cutter, comprising:

a substrate; and

a diamond table mounted to the substrate, the diamond table comprising diamond crystals and interstitial catalyst binder, the diamond table further having a front face with a thermal channel formed to additionally include a material, the material being less thermally expandable than the catalyst binder and/or more thermally conductive than the catalyst binder and/or having a lower heat capacity than the catalyst binder, the material being commingled with or semi-alloyed with the catalyst binder in the thermal channel to a desired depth.

2. The PDC cutter of claim 1 wherein the material is cubic boron nitride or a component of cubic boron nitride.

3. The PDC cutter of claim 1 wherein the material is an elemental material selected from a group consisting of: carbon, germanium, zinc, aluminum, silicon, molybdenum, boron, phosphorous, copper, silver, and gold.

4. The PDC cutter of claim 1 wherein the material is one of:

a combination of two or more of the elemental materials selected from a group consisting of: carbon, germanium, zinc, aluminum, silicon, molybdenum, boron, phosphorous, copper, silver, and gold; or

an alloy including one or more of the elemental materials selected from the group consisting of: carbon, germanium, zinc, aluminum, silicon, molybdenum, boron, phosphorous, copper, silver, and gold.

5. The PDC cutter of claim 1 wherein the material includes an alkali earth carbonate.

6. The PDC cutter of claim 1 wherein the material includes a sulfate.

7. The PDC cutter of claim 1 wherein the material includes a hydroxide.

8. The PDC cutter of claim 1 wherein the material is tungsten oxide.

9. The PDC cutter of claim 1 wherein the material is boron carbide.

10. The PDC cutter of claim 1 wherein the material is TiC 0.6 .

11. The PDC cutter of claim 1 wherein the material is one of an iron oxide or double oxide.

12. The PDC cutter of claim 1 wherein the material is an intermetallic material.

13. The PDC cutter of claim 1 wherein the material is a ceramic material.

14. The PDC cutter of claim 1 wherein the desired depth is between 0.020 mm to 0.6 mm.

15. A method, comprising:

introducing a material to a front face of a diamond table mounted to a substrate, the diamond table comprising diamond crystals and interstitial catalyst binder, the introduction of the material to the front face forming a thermal channel which additionally includes the material, the material being less thermally expandable than the catalyst binder and/or more thermally conductive than the catalyst binder and/or having a lower heat capacity than the catalyst binder, the introduced material being commingled with or semi-alloyed with the catalyst binder in the thermal channel to a desired depth.

16. The method of claim 15 wherein the material is cubic boron nitride or component thereof.

17. The method of claim 15 wherein the material is an elemental material selected from a group consisting of: carbon, germanium, zinc, aluminum, silicon, molybdenum, boron, phosphorous, copper, silver, and gold.

18. The method of claim 15 wherein the material is one of:

a combination of two or more of the elemental materials selected from a group consisting of: carbon, germanium, zinc, aluminum, silicon, molybdenum, boron, phosphorous, copper, silver, and gold; or

an alloy including one or more of the elemental materials selected from the group consisting of: carbon, germanium, zinc, aluminum, silicon, molybdenum, boron, phosphorous, copper, silver, and gold.

19. The method of claim 15 wherein the material includes an alkali earth carbonate.

20. The method of claim 15 wherein the material includes a sulfate.

21. The method of claim 15 wherein the material includes a hydroxide.

22. The method of claim 15 wherein the material is tungsten oxide.

23. The method of claim 15 wherein the material is boron carbide.

24. The method of claim 15 wherein the material is TiC 0.6 .

25. The method of claim 15 wherein the material is one of an iron oxide or double oxide.

26. The method of claim 15 wherein the material is an intermetallic material.

27. The method of claim 15 wherein the material is as ceramic material.

28. The method of claim 15 wherein introducing comprises infusing the material into the diamond table thermal channel.

29. The method of claim 15 wherein introducing comprises implanting the material into the diamond table thermal channel.

30. The method of claim 15 wherein introducing comprises sintering the material into the diamond table thermal channel.

31. The method of claim 15 wherein introducing comprises hot isostatic pressing the material into the diamond table thermal channel.

32. The method of claim 15 wherein introducing comprises performing cryogenic methods or cold pressing or both to introduce the material into the diamond table thermal channel.

33. A polycrystalline diamond compact (PDC) cutter, comprising:

a substrate; and

a diamond table mounted to the substrate, the diamond table comprising diamond crystals and interstitial catalyst binder, the diamond table further having a front face with a thermal channel formed to additionally include a material, the material being less thermally expandable than the catalyst binder and/or more thermally conductive than the catalyst binder and/or having a lower heat capacity than the catalyst binder, the material partially displacing the catalyst binder in the thermal channel to a desired depth, the displaced catalyst binder remaining in either the diamond table or the substrate.

34. A method, comprising:

introducing a material to a front face of a diamond table mounted to a substrate, the diamond table comprising diamond crystals and interstitial catalyst binder, the introduction of the material to the front face forming a thermal channel which additionally includes the material, the material being less thermally expandable than the catalyst binder and/or more thermally conductive than the catalyst binder and/or having a lower heat capacity than the catalyst binder, the introduced material partially displacing the catalyst binder in the thermal channel to a desired depth, the displaced catalyst binder remaining in either the diamond table or the substrate.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Jun 4, 2014
From: CREDIT SUISSE AG, CAYMAN ISLAND BRANCH
To: VAREL INTERNATIONAL IND., L.P
Reel/Frame 033083/0969 →
SECURITY AGREEMENT Recorded Jan 31, 2013
From: VAREL INTERNATIONAL ENERGY FUNDING CORP.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 029731/0721 →
PATENT SECURITY AGREEMENT Recorded Jan 23, 2013
From: VAREL INTERNATIONAL IND., L.P.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 029682/0024 →
RELEASE OF SECURITY INTEREST Recorded Jan 16, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: VAREL INTERNATIONAL IND., L.P.
Reel/Frame 029644/0462 →
RELEASE OF SECURITY INTEREST Recorded Feb 8, 2012
From: DRILLBIT WCF II LIMITED
To: VAREL INTERNATIONAL IND., L.P.
Reel/Frame 027787/0370 →
RELEASE OF SECURITY INTEREST Recorded Sep 27, 2011
From: DRILLBIT WCF LIMITED
To: VAREL INTERNATIONAL IND., L.P.
Reel/Frame 026972/0575 →
SECURITY AGREEMENT Recorded Sep 26, 2011
From: VAREL INTERNATIONAL IND., L.P.
To: DRILLBIT WCF II LIMITED
Reel/Frame 026970/0678 →
NOTICE OF SUBSTITUTION OF AGENT IN INTELLECTUAL PROPERTY Recorded Sep 16, 2011
From: LEHMAN COMMERCIAL PAPER INC.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 027127/0635 →
SECURITY AGREEMENT Recorded Mar 1, 2011
From: VAREL INTERNATIONAL IND., L.P.
To: DRILLBIT WCF LIMITED
Reel/Frame 025877/0447 →
SECURITY AGREEMENT Recorded Jun 17, 2010
From: VAREL INTERNATIONAL IND., L.P.
To: LEHMAN COMMERCIAL PAPER INC.
Reel/Frame 024547/0944 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 2, 2010
From: DOURFAYE, ALFAZAZI; REESE, MICHAEL; KING, WILLIAM W.
To: VAREL INTERNATIONAL, IND., L.P.
Reel/Frame 024017/0692 →