Composite structured organic films
View Patent ↗A structured organic film with an added functionality comprising a plurality of segments and a plurality of linkers arranged as a covalent organic framework, wherein the structured organic film may be a multi-segment thick structured organic film.
1. A composite structured organic film (SOF) comprising a plurality of segments including at least a first segment type and a plurality of linkers including at least a first linker type arranged as a covalent organic framework (COF), wherein
the first segment type and/or the first linker type comprises at least one atom that is not carbon,
the SOF is a substantially defect-free film having less than 10 pinholes, pore or gaps greater than about 250 nanometers in diameter per cm 2 ,
the SOF comprises a secondary component, and
the SOF has a thermal stability higher than 400° C. under atmospheric conditions.
2. The SOF of claim 1 , wherein the secondary component is selected from the group consisting of conductivity agents, semiconductor agents, electron transport agents, hole transport agents, p-type materials, n-type materials, hydrophobic agents, hydrophilic agents, impact modifiers, reinforcing fibers, lubricants, antistatic agents, coupling agents, wetting agents, antifogging agents, flame retardants, ultraviolet stabilizers, antioxidants, biocides, dyes, pigments, odorants, deodorants, and nucleating agents.
3. The SOF of claim 1 , wherein the secondary component enhances an inclined or inherent property of the SOF.
4. The SOF of claim 1 , wherein the secondary component attenuates an inclined or inherent property of the SOF.
5. The SOF of claim 1 , wherein the secondary component is not covalently bound to the SOF.
6. The SOF of claim 1 , wherein the SOF is a single layer that is multi-segment thick.
7. The SOF of claim 1 , wherein the SOF is a single layer that is mono-segment thick.
8. The SOF of claim 1 , wherein the plurality of segments consists of segments having the first segment type comprising at least one atom that is not carbon, and the plurality of linkers consists of linkers of the first linker type.
9. The SOF of claim 1 , wherein the plurality of segments comprises at least the first segment type comprising at least one atom that is not carbon and a second segment type that is structurally different from the first segment type.
10. The SOF of claim 1 , wherein the at least one atom of an element that is not carbon is selected from the group consisting of hydrogen, oxygen, nitrogen, silicon, phosphorous, selenium, fluorine, boron, and sulfur.
11. The SOF of claim 1 , wherein the SOF is a mono-segment thick layer with a thickness of from about 10 Angstroms to about 250 Angstroms; or the SOF is a multi-segment thick layer with a thickness of from about 20 nm to about 5 mm.
12. A process for preparing a composite structured organic film (SOF) comprising:
(a) preparing a liquid-containing reaction mixture comprising:
a secondary component, and
a plurality of molecular building blocks each comprising a segment and a number of functional groups;
(b) depositing the reaction mixture as a wet film; and
(c) promoting change of the wet film to form a dry SOF that incorporates the secondary component; wherein the SOF has a thermal stability higher than 400° C. under atmospheric conditions and is a substantially defect-free film having less than 10 pinholes, pore or gaps greater than about 250 nanometers in diameter per cm 2 .
13. The process of claim 12 , further comprising promoting a reaction of the functional groups, wherein a volatile byproduct is formed as a result of the reaction of the functional groups.
14. The process of claim 12 , wherein the SOF is formed after the wet film is exposed to oven drying or infrared radiation (IR) drying or oven drying and IR drying.
15. The process of claim 12 , wherein the reaction mixture is deposited as a wet film on a substrate.
16. The process of claim 15 , wherein the substrate is a SOF substrate.
17. The process of claim 16 , further comprising chemically attaching the dry SOF to the SOF substrate by either covalent or ionic bonds.
18. The process of claim 12 , wherein the dry SOF comprises a plurality of segments including at least a first segment type, a plurality of linkers including at least a first linker type arranged as a covalent organic framework (COF), wherein the first segment type and/or the first linker type comprises at least one atom that is not carbon.
19. A process for preparing a composite structured organic film (SOF) comprising:
(a) preparing a liquid-containing reaction mixture comprising:
a plurality of molecular building blocks each comprising a segment and a number of functional groups;
(b) depositing the reaction mixture as a wet film;
(c) distributing a secondary component on the surface of the wet film; and
(d) promoting change of the wet film to form a dry SOF that incorporates the secondary component; wherein the SOF has a thermal stability higher than 400° C. under atmospheric conditions and is a substantially defect-free film having less than 10 pinholes, pore or gaps greater than about 250 nanometers in diameter per cm 2 .
20. The process of claim 19 , wherein distributing a secondary component on the surface of the wet film affords a pattern of the secondary component.
21. The process of claim 19 , wherein the dry SOF comprises a plurality of segments including at least a first segment type, a plurality of linkers including at least a first linker type arranged as a covalent organic framework (COF), wherein the first segment type and/or the first linker type comprises at least one atom that is not carbon.
22. A composite structured organic film (SOF) comprising a plurality of segments including at least a first segment type and a plurality of linkers including at least a first linker type arranged as a covalent organic framework (COF), wherein
the first segment type and/or the first linker type comprises a hydrogen,
the SOF is a substantially defect-free film having less than 10 pinholes, pore or gaps greater than about 250 nanometers in diameter per cm 2 ,
the SOF comprises a secondary component and
the SOF has a thermal stability higher than 400° C. under atmospheric conditions.
23. The SOF of claim 22 , wherein the plurality of segments consists of segments having the first segment type comprising a hydrogen atom, and the plurality of linkers consists of linkers of the first linker type.
24. The SOF of claim 22 , wherein the plurality of segments comprises at least the first segment type comprising a hydrogen atom and a second segment type that is structurally different from the first segment type.
25. The SOF of claim 22 , wherein the plurality of linkers comprises at least the first linker type comprising a hydrogen and a second linker type that is structurally different from the first linker type.
26. The SOF of claim 22 , wherein the plurality of segments have a core selected from the group consisting of carbon, nitrogen, silicon, or phosphorous atomic cores, alkoxy cores, aryl cores, carbonate cores, carbocyclic cores, carbobicyclic cores, carbotricyclic cores, and oligothiophene cores; or the plurality of linkers are selected from the group consisting of single atom linkers, single covalent bond linkers, and double covalent bond linkers, ester linkers, ketone linkers, amide linkers, amine linkers, imine linkers, ether linkers, urethane linkers, and carbonates linkers.
27. The SOF of claim 22 , wherein the plurality of segments and/or the plurality of linkers comprises at least one atom selected from the group consisting of oxygen, nitrogen, silicon, phosphorous, selenium, fluorine, boron, and sulfur.
28. The SOF of claim 22 , wherein the SOF is a mono-segment thick layer with a thickness of from about 10 Angstroms to about 250 Angstroms; or the SOF is a multi-segment thick layer with a thickness of from about 20 nm to about 5 mm.