Structure and method to fabricate pFETS with superior GIDL by localizing workfunction

1. A semiconductor structure comprising:

a semiconductor substrate including at least one patterned gate stack located within a pFET device region of said semiconductor substrate, said at least one patterned gate stack comprises a high k gate dielectric located on an upper surface of said semiconductor substrate, and a metal gate electrode located atop the high k gate dielectric;

a spacer located on said upper surface of said semiconductor substrate, said spacer having an inner edge in contact with a vertical sidewall of said at least one patterned gate stack and an opposing outer edge;

extension regions located within said semiconductor substrate at a footprint of said at least one patterned gate stack;

a channel region located within said semiconductor substrate beneath said at least one patterned gate stack; and

a localized workfunction tuning area located within a portion of at least one of said extension regions that is positioned adjacent said channel region, but not extending beyond said outer edge of said spacer, and within at least one sidewall portion of the at least one gate stack including a sidewall portion of the high k gate dielectric and the metal gate electrode, wherein other portions of said at least one of said extension regions that extend beyond the outer edge of said spacer, and other portions of said at least one patterned gate stack adjacent said at least one sidewall portion of said patterned gate stack are void of said localized workfunction tuning area.

2. The semiconductor structure of claim 1 wherein said localized workfunction tuning area includes a workfunction tuning species selected from one of fluorine, bromine, chlorine, iodine, oxygen, and sulfur.

3. The semiconductor structure of claim 2 wherein said workfunction tuning species is fluorine or oxygen.

4. The semiconductor structure of claim 1 wherein said at least one patterned gate stack further comprises a doped layer of a Si-containing material atop said metal gate electrode.

5. The semiconductor structure of claim 1 further comprising at least one patterned gate stack within an nFET device region, said at least one patterned gate stack within said nFET device region is devoid of said localized workfunction tuning species area.

6. A method of forming a semiconductor structure comprising:

forming at least one patterned gate stack within a pFET device region of a semiconductor substrate;

forming extension regions within said semiconductor substrate at a footprint of the at least one patterned gate stack, wherein said extension regions define a channel region located beneath the at least one patterned gate stack;

introducing a workfunction tuning species by angled ion implantation into a portion of at least one of said extension regions that is located adjacent to the channel region of the at least one patterned gate stack and into at least one sidewall portion of the at least one patterned gate stack; and

forming a spacer on said semiconductor substrate with said pFET device region, said spacer having an inner edge in contact with a vertical sidewall of said at least one patterned gate stack in said pFET device region and an opposing outer edge.

7. The method of claim 6 wherein said angled ion implantation comprises selecting at least one of fluorine, bromine, chlorine, iodine, oxygen, and sulfur as an implant ion.

8. The method of claim 6 wherein said angled ion implantation is performed utilizing a tilt angle from 5° to 45°.

9. The method of claim 8 wherein said at least one workfunction tuning species is implanted using an ion dose from 10E13 atoms/cm 2 to 10E19 atoms/cm 2 .

10. The semiconductor structure of claim 1 wherein said localized workfunction tuning area is present on only one side of said at least one patterned gate stack.

11. The method of claim 6 wherein said introducing the workfunction tuning species occurs only on one side of said at least one patterned gate stack.

12. The method of claim 6 further comprising forming at least one patterned gate stack within an nFET device region of the semiconductor substrate, and protecting the nFET device region during said introducing said workfunction tuning species.

13. A method of forming a semiconductor structure comprising:

forming at least one patterned gate stack within a pFET device region of a semiconductor substrate and at least one patterned gate stack within an nFET device region of said semiconductor structure;

forming extension regions within said semiconductor substrate at a footprint of the at least one patterned gate stack within said pFET device region, wherein said extension regions define a channel region located beneath the at least one patterned gate stack within said pFET device region; and

introducing a workfunction tuning species by only an anneal process comprising an atmosphere containing said workfunction tuning species into a portion of at least one of said extension regions that is located adjacent to the channel region of the at least one patterned gate stack within said pFET device region and into at least one sidewall portion of the at least one patterned gate stack within said pFET device region, wherein said at least one patterned gate stack within said nFET device region is protected during said introducing said workfunction tuning species.

14. The method of claim 13 wherein said anneal process is performed at a temperature from 300° C. to 600° C.

15. The method of claim 13 wherein said introducing the workfunction tuning species occurs only on one side of said at least one patterned gate stack.