Multilayer stacked type nonvolatile semiconductor memory device
A nonvolatile semiconductor memory device includes: a substrate; a memory multilayer body with a plurality of insulating films and electrode films alternately stacked therein, the memory multilayer body being provided on a memory array region of the substrate; a semiconductor pillar buried in the memory multilayer body and extending in stacking direction of the insulating films and the electrode films; a charge storage film provided between one of the electrode films and the semiconductor pillar; a dummy multilayer body with a plurality of the insulating films and the electrode films alternately stacked therein and a dummy hole formed therein, the dummy multilayer body being provided on a peripheral circuit region of the substrate; an insulating member buried in the dummy hole; and a contact buried in the insulating member and extending in the stacking direction.
1. A nonvolatile semiconductor memory device comprising:
a substrate;
a memory multilayer body with a plurality of insulating films and electrode films alternately stacked therein, the memory multilayer body being provided on a memory array region of the substrate;
a semiconductor pillar buried in the memory multilayer body and extending in stacking direction of the insulating films and the electrode films;
a charge storage film provided between one of the electrode films and the semiconductor pillar;
a dummy multilayer body with a plurality of the insulating films and the electrode films alternately stacked therein and a dummy hole formed therein, the dummy multilayer body being provided on a peripheral circuit region of the substrate;
an insulating member buried in the dummy hole; and
a plurality of contacts buried in the insulating member and extending in the stacking direction so that each of the plurality of contacts buried in the insulating member are buried in the dummy hole,
wherein an equal potential is applied to the plurality of the contacts.
2. The nonvolatile semiconductor memory device according to claim 1 , wherein
the substrate is made of a semiconductor material,
a field-effect transistor is formed in the peripheral circuit region, and
the plurality of the contacts are connected to a source layer of the field-effect transistor.
3. The nonvolatile semiconductor memory device according to claim 1 , wherein
the substrate is made of a semiconductor material,
a field-effect transistor is formed in the peripheral circuit region, and
the plurality of the contacts are connected to a drain layer of the field-effect transistor.
4. The nonvolatile semiconductor memory device according to claim 1 , wherein
the substrate is made of a semiconductor material,
a field-effect transistor is formed in the peripheral circuit region, and
the plurality of the contacts are connected to a gate electrode of the field-effect transistor.
5. A nonvolatile semiconductor memory device, comprising:
a substrate;
a memory multilayer body with a plurality of insulating films and electrode films alternately stacked therein, the memory multilayer body being provided on a memory array region of the substrate;
a semiconductor pillar buried in the memory multilayer body and extending in stacking direction of the insulating films and the electrode films;
a charge storage film provided between one of the electrode films and the semiconductor pillar;
a dummy multilayer body with a plurality of the insulating films and the electrode films alternately stacked therein and a dummy hole formed therein, the dummy multilayer body being provided on a peripheral circuit region of the substrate;
an insulating member buried in the dummy hole; and
a plurality of contacts buried in the insulating member and extending in the stacking direction so that each of the plurality of contacts buried in the insulating member are buried in the dummy hole,
wherein as viewed in the stacking direction, the plurality of the contacts are placed at positions displaced from a center line extending longitudinally along the dummy hole.
6. The nonvolatile semiconductor memory device according to claim 5 , wherein
the substrate is made of a semiconductor material,
a field-effect transistor is formed in the peripheral circuit region, and
one of the plurality of the contacts is connected to a source layer or a drain layer of the field-effect transistor, and another of the plurality of the contacts is connected to a gate electrode of the field-effect transistor.
7. The nonvolatile semiconductor memory device according to claim 5 , wherein
the substrate is made of a semiconductor material,
a plurality of field-effect transistors are formed in the peripheral circuit region, and
the plurality of the contacts are connected to respective gate electrodes of the plurality of field-effect transistors.
8. The nonvolatile semiconductor memory device according to claim 1 , further comprising:
a spacer insulating film formed on a side surface of a contact hole having the contact buried therein.
9. The nonvolatile semiconductor memory device according to claim 8 , wherein the insulating member is made of silicon oxide, and the spacer insulating film is made of silicon nitride.
10. The nonvolatile semiconductor memory device according to claim 8 , wherein
the substrate is made of a semiconductor material,
a field-effect transistor is formed in the peripheral circuit region, and
of the plurality of the contacts, one is connected to a source layer or a drain layer of the field-effect transistor, and another is connected to a gate electrode of the field-effect transistor.
11. The nonvolatile semiconductor memory device according to claim 8 , wherein
the substrate is made of a semiconductor material,
a plurality of field-effect transistors are formed in the peripheral circuit region, and
the plurality of the contacts are connected to respective gate electrodes of the plurality of field-effect transistors.
12. The nonvolatile semiconductor memory device according to claim 1 , wherein
as viewed in the stacking direction, the plurality of the contacts are placed at positions displaced from a center line extending longitudinally along the dummy hole, and
an equal potential is applied to the plurality of the contacts.
13. The nonvolatile semiconductor memory device according to claim 1 , further comprising:
a spacer insulating film formed on a side surface of a contact hole having the contact buried therein,
an equal potential being applied to the plurality of the contacts.
14. The nonvolatile semiconductor memory device according to claim 1 , further comprising:
a spacer insulating film formed on a side surface of a contact hole having the contact buried therein,
as viewed in the stacking direction, the plurality of the contacts being placed at positions displaced from a center line extending longitudinally along the dummy hole.
15. The nonvolatile semiconductor memory device according to claim 1 , further comprising:
a spacer insulating film formed on a side surface of a contact hole having the contact buried therein,
as viewed in the stacking direction, the plurality of the contacts being placed at positions displaced from a center line extending longitudinally along the dummy hole, and
an equal potential being applied to the plurality of the contacts.
16. The nonvolatile semiconductor memory device according to claim 1 , wherein number of the electrode films stacked in the dummy multilayer body is equal to the number of the electrode films stacked in the memory multilayer body.
17. The nonvolatile semiconductor memory device according to claim 1 , wherein upon the upper surface of the substrate being partitioned into a plurality of unit regions, the memory multilayer body and the dummy multilayer body are provided in each of the unit regions at an area ratio of 50% or more in total.
18. The nonvolatile semiconductor memory device according to claim 17 , wherein the each of the unit regions is a square region measuring 10 microns on a side.