IP Library Granted Patent US 8,123,514
Granted Patent B2
US 8,123,514 · App. 12/717,664 · Granted Feb 28, 2012

Conforming template for patterning liquids disposed on substrates

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,123,514
App. No.
12/717,664
Granted
Feb 28, 2012
Kind
B2
Abstract

The present invention includes a template for patterning liquids disposed on a substrate. The template includes a body having opposed first and second surfaces with one surface having at least one recess and the other surface having a patterning region. In one embodiment, the template may be mounted to a fluid chamber having an inlet and a throughway. The template may be connected to the throughway and the inlet is connected to a fluid source.

Claims (32)

1. A system comprising:

a substrate having a plurality of droplets positioned thereon;

a mold assembly, spaced-apart from the substrate, for imprinting a pattern in a deformable material, the mold assembly having first and second surfaces, with the first surface including at least one recessed region and the second surface defining a patterning region configured to provide the pattern in the deformable material;

a mold deformation enabling apparatus coupled to the mold assembly to facilitate deformation of the mold assembly to conform to a layer formed from the plurality of droplets, wherein the mold deformation enabling apparatus includes a chamber having an inlet and a throughway, with the mold assembly being connected to the throughway; and,

a source of fluid in fluid communication with chamber through the inlet, varying pressure at the recessed region.

2. The system as recited in claim 1 , wherein the chamber includes a plurality of walls, with the plurality of walls being more rigid than the mold assembly.

3. The system as recited in claim 1 , wherein the patterning region has a profile selected from a set of profiles including smooth, planar, and patterned.

4. The system as recited in claim 1 , wherein the patterning region covers an area of the second surface that has a polygonal shape.

5. The system as recited in claim 1 , further including a plurality of the patterning regions arranged in a two-dimensional array.

6. The system as recited in claim 1 , wherein the pattern includes a plurality of protrusions and recessions having submicron dimensions.

7. A system comprising:

a mold assembly for imprinting a pattern in a deformable material, the mold assembly having first and second surfaces, with the first surface including at least one recessed region and the second surface defining a patterning region configured to provide the pattern in the deformable material;

a mold deformation enabling apparatus coupled to the mold assembly to facilitate deformation of the mold assembly to conform to a profile of a surface adjacent to the mold assembly, wherein the mold deformation enabling apparatus includes a chamber having an inlet and a throughway, with the mold assembly being connected to the throughway; and,

a source of fluid in fluid communication with chamber through the inlet, varying pressure at the recessed region.

8. The system as recited in claim 7 , wherein the surface further includes a plurality of spaced-apart droplets positioned thereon.

9. The system as recited in claim 7 , wherein the chamber includes a plurality of walls.

10. The system as recited in claim 9 , wherein the plurality of walls is more rigid than the mold assembly.

11. The system as recited in claim 7 , wherein the patterning region is patterned.

12. The system as recited in claim 7 , wherein the patterning region is planar.

13. The system as recited in claim 7 , wherein a portion of the patterning region is patterned and a portion of the patterning region is planar.

14. The system as recited in claim 7 , wherein the patterning region covers an area of the second surface that has a polygonal shape.

15. The system as recited in claim 7 , further including a plurality of the patterning regions arranged in a two-dimensional array.

16. The system as recited in claim 7 , wherein the pattern includes a plurality of protrusions and recessions.

17. The system as recited in claim 16 , wherein the plurality of protrusions and recessions have submicron dimensions.

18. A system comprising:

a substrate having a plurality of droplets positioned thereon;

a mold assembly, spaced-apart from the substrate, for imprinting a pattern in a deformable material, the mold assembly having first and second surfaces, with the first surface including at least one recessed region and the second surface defining a patterning region configured to provide the pattern in the deformable material;

a chamber having an inlet and a throughway, with the template being connected to the throughway to facilitate deformation of the mold assembly to conform to a layer formed from the plurality of droplets;

a source of fluid in fluid communication with the chamber through the inlet, varying pressure at the recessed region; and

a source of radiation to impinge actinic radiation upon the layer.

19. The system as recited in claim 18 , wherein the chamber includes a plurality of walls, with the plurality of walls being more rigid than the mold assembly.

20. The system as recited in claim 18 , wherein the patterning region has a profile selected from a set of profiles including smooth, planar, and patterned.

Assignments (2)
ASSIGNMENT OF SECURITY INTEREST IN PATENTS Recorded Nov 7, 2019
From: JPMORGAN CHASE BANK, N.A.
To: CITIBANK, N.A.
Reel/Frame 050967/0138 →
PATENT SECURITY AGREEMENT Recorded Aug 22, 2019
From: MAGIC LEAP, INC.; MOLECULAR IMPRINTS, INC.; MENTOR ACQUISITION ONE, LLC
To: JP MORGAN CHASE BANK, N.A.
Reel/Frame 050138/0287 →