Layered scanning charged particle apparatus package having an embedded heater
View Patent ↗A scanning charge particle apparatus includes a layered charged particle beam column package; a sample holder; and a heater, such as a resistive heater, in one of the layers of the package that conductively heats layers and/or components.
1. A scanning charged particle apparatus, comprising:
a layered charged particle beam column package having components for charged beam column operation;
a sample holder; and
a heater embedded in a layer of the column package.
2. The apparatus of claim 1 , wherein the layers of the package are ceramic.
3. The apparatus of claim 2 , wherein the package layers are made of LTCC or HTCC.
4. The apparatus of claim 1 , further comprising additional heaters placed symmetrically around at least one of the components.
5. The apparatus of claim 1 , further comprising additional heaters in other layers of the column package.
6. The apparatus of claim 1 , wherein the heater is a resistive heater.
7. The apparatus of claim 1 , wherein the heater is configured to heat individual components of the particle beam column via thermal conduction from the layered package thereby requiring no additional electrical connections.
8. The apparatus of claim 1 , further comprising a temperature sensing device configured to close a feedback loop and set the temperature of the particle beam column.
9. The apparatus of claim 1 , wherein the microscope includes a low-vacuum particle beam system.
10. A method, comprising:
generating a charged particle beam;
focusing the beam with a charged particle beam column onto a sample, the column having a layered charged particle beam column package with components for charged beam column operation; a sample holder holding the sample; and a heater embedded in a layer of the package;
heating the layer with the embedded heater;
scanning the beam over the sample; and
detecting charged particles from the sample.
11. The method of claim 10 , wherein the layers of the package are ceramic.
12. The method of claim 11 , wherein the package layers are made of LTCC or HTCC.
13. The method of claim 10 , wherein the column package further comprises additional heaters placed symmetrically around at least one of the components.
14. The method of claim 10 , wherein the column package further comprises additional heaters in other layers of the column package.
15. The method of claim 10 , further comprising heating a component with the heater.
16. The method of claim 10 , wherein the heater is a resistive heater.
17. The method of claim 10 , further comprising heating individual components of the particle beam column via thermal conduction from the layered package thereby requiring no additional electrical connections.
18. The method of claim 10 , further comprising:
sensing a temperature of the column; and
setting, using the heater, a temperature of the column based on the sensing in a closed loop feedback manner.
19. The method of claim 10 , wherein the method operates in a low-vacuum particle beam system.