Semiconductor laser device
View Patent ↗High performance and high reliability of a semiconductor laser device having a buried-hetero structure are achieved. The semiconductor laser device having a buried-hetero structure is manufactured by burying both sides of a mesa structure by a Ru-doped InGaP wide-gap layer and subsequently by a Ru-doped InGaP graded layer whose composition is graded from InGaP to InP, and then, by a Ru-doped InP layer. By providing the Ru-doped InGaP graded layer between the Ru-doped InGaP wide-gap layer and the Ru-doped InP layer, the Ru-doped InGaP wide-gap layer and the Ru-doped InP layer not lattice-matching with each other can be formed as a buried layer with excellent crystallinity.
1. A semiconductor laser device comprising, on a semiconductor substrate:
an n-type cladding layer; an active layer; and a p-type cladding layer,
both sides of each of the n-type cladding layer, the active layer, and the p-type cladding layer being buried by a semi-insulating semiconductor layer, wherein
the semi-insulating semiconductor layer has a stacked structure formed of an InP layer, an InGaP graded layer, and an InGaP layer, and
Ru is added to each of the InP layer, the InGaP graded layer, and the InGaP layer.
2. The semiconductor laser device according to claim 1 , wherein
the InGaP layer and the InGaP graded layer are provided between the active layer and the InP layer and between either one of the cladding layers and the InP layer.
3. The semiconductor laser device according to claim 1 , wherein
the InGaP graded layer is provided between the InGaP layer and the InP layer.
4. The semiconductor laser device according to claim 1 , wherein
a film thickness of the InGaP layer is a critical thickness or thinner.
5. The semiconductor laser device according to claim 1 which is an edge-emission-type laser device.
6. The semiconductor laser device according to claim 1 which is a bottom-emission-type laser device.
7. The semiconductor laser device according to claim 1 which is a modulator-integrated light source in which a modulator unit and a waveguiding unit are further formed on a main surface of the semiconductor substrate.
8. The semiconductor laser device according to claim 1 which is a MZ modulator in which an input-light demultiplexer unit, a MZ modulator unit, and an output-light multiplexer unit are formed on a main surface of the semiconductor substrate.
9. A semiconductor laser device comprising:
a semiconductor substrate; a first cladding layer of a first conductivity type on the semiconductor substrate; an active layer on the first cladding layer; and a second cladding layer of a second conductivity type on the active layer,
both sides of each of the first cladding layer, the active layer, and the second cladding layer being buried by a semi-insulating semiconductor layer, wherein
the semi-insulating semiconductor layer has a stacked structure formed of an InP layer, an InGaP graded layer, and an InGaP layer, and
Ru is added to each of the InP layer, the InGaP graded layer, and the InGaP layer.
10. The semiconductor laser device according to claim 9 , wherein
the InGaP layer and the InGaP graded layer are provided between the active layer and the InP layer and between either one of the cladding layers and the InP layer.
11. The semiconductor laser device according to claim 9 , wherein
the InGaP graded layer is provided between the InGaP layer and the InP layer.
12. The semiconductor laser device according to claim 9 , wherein
a film thickness of the InGaP layer is a critical thickness or thinner.
13. The semiconductor laser device according to claim 9 which is an edge-emission-type laser device.
14. The semiconductor laser device according to claim 9 which is a bottom-emission-type laser device.
15. The semiconductor laser device according to claim 9 which is a modulator-integrated light source in which a modulator unit and a waveguiding unit are further formed on a main surface of the semiconductor substrate.
16. The semiconductor laser device according to claim 9 which is a MZ modulator in which an input-light demultiplexer unit, a MZ modulator unit, and an output-light multiplexer unit are formed on a main surface of the semiconductor substrate.