High breakdown voltage semiconductor device and high voltage integrated circuit
View Patent ↗A high breakdown voltage semiconductor device, in which a semiconductor layer is formed on a semiconductor substrate across a dielectric layer, includes a drain layer on the semiconductor layer, a buffer layer formed so as to envelop the drain layer, a source layer, separated from the drain layer, and formed so as to surround a periphery thereof, a well layer formed so as to envelop the source layer, and a gate electrode formed across a gate insulating film on the semiconductor layer, wherein the planar shape of the drain layer 113 and buffer layer is a non-continuous or continuous ring.
1. A high breakdown voltage semiconductor device, comprising:
a support substrate;
a first conductive type semiconductor layer formed on the support substrate across a dielectric layer;
a first conductive type drain layer, with an impurity concentration higher than that of the semiconductor layer, on the semiconductor layer;
a first conductive type buffer layer, formed on the surface of the semiconductor layer so as to envelop the drain layer, and with an impurity concentration between those of the semiconductor layer and drain layer;
a first conductive type source layer with an impurity concentration higher than that of the semiconductor layer, separated from the drain layer, and formed so as to surround a periphery thereof;
a second conductive type well layer formed so as to envelop the source layer;
a gate electrode formed on the source layer, the second conductive type well layer, and the semiconductor layer and interposed between the well layer and buffer layer, across a gate insulating film;
a drain electrode electrically connected to the drain layer; and
a source electrode electrically connected to the source layer,
wherein the planar shape of the drain layer and buffer layer is a continuous ring or a non-continuous ring comprising slits between portions of the buffer layer.
2. The high breakdown voltage semiconductor device according to claim 1
wherein the high breakdown voltage semiconductor device includes a second conductive type diffusion layer formed on the interior side of the ring at a depth from the surface of the semiconductor layer greater than that of the buffer layer.
3. The high breakdown voltage semiconductor device according to claim 1 , further comprising a drain pad electrically connected to the drain electrode, across an insulating film, on the semiconductor layer on the interior side of the drain layer, and has a bonding wire connected to the drain pad.
4. The high breakdown voltage semiconductor device according to claim 2 , further comprising a drain pad electrically connected to the drain electrode, across an insulating film, on the semiconductor layer on the interior side of the drain layer, and has a bonding wire connected to the drain pad.
5. The high breakdown voltage semiconductor device according to claim 1 , wherein the planar shape of the drain layer and buffer layer is a non-continuous ring comprising slits between portions of the buffer layer.
6. The high breakdown voltage semiconductor device according to claim 1 , wherein the planar shape of the drain layer and buffer layer is a continuous ring.
7. The high breakdown voltage semiconductor device according to claim 5 , wherein the buffer layer is configured as four fan-shaped regions isolated by slits to form a non-continuous ring.
8. The high breakdown voltage semiconductor device according to claim 5 , wherein the buffer layer is configured as one semi-circular region and two fan-shaped regions isolated by slits to form a non-continuous ring.
9. The high breakdown voltage semiconductor device according to claim 8 , wherein the drain layer is formed as three discontinuous regions.
10. The high breakdown voltage semiconductor device according to claim 8 , wherein the drain layer is formed as four discontinuous regions.