IMPRINT STAMPER AND IMPRINT DEVICE
An imprint stamper and imprint device are provided which, at the same time as being able to swiftly separate a substrate from a stamper after imprinting utilizing an even bowing and the resilience of the stamper when imprinting, can respond to a switch to mass production by making it difficult for a defect to occur on the pattern surface of the substrate and stamper. A stamper is configured of a plate-shaped body whose Young's modulus is 50 GPa or more, 500 GPa or less, whose thickness is 200 μm or more, 1000 μm or less, and which has a bow with a curvature of 2×10 −5 or more, 2×10 −3 or less, wherein a microstructure pattern to be transferred is provided on one surface.
1 . An imprint stamper comprising:
a plate-shaped body whose Young's modulus is 50 GPa or more, 500 GPa or less, whose thickness is 200 μm or more, 1000 μm or less, and which has a bow with a curvature of 2×10 −5 or more, 2×10 −3 or less; and
a microstructure pattern provided on one surface of the plate-shaped body.
2 . An imprint device comprising:
a pressing unit adapted to receive an imprint stamper and a transfer receiving substrate in a condition in which th imprint stamper and the transfer receiving substrate are superimposed one on the other;
wherein the imprint stamper includes a plate-shaped body whose Young's modulus is 50 GPa or more, 500 GPa or less, whose thickness is 200 μm or more, 1000 μm or less, and which has a bow with a curvature of 2×10 −5 or more, 2×10 −3 or less, and a microstructure pattern provided on one surface of the plate-shaped body; and
wherein the pressing unit corrects the bow of the imprint stamper and applies a pressing force in order to transfer the microstructure pattern to the transfer receiving substrate.
3 . The imprint device according to claim 2 , wherein the pressing unit includes an upper die and a lower die which sandwich and press the imprint stamper and transfer receiving substrate in the condition in which they are superimposed one on the other.
4 . The imprint device according to claim 2 , wherein a hole is opened in the center of the imprint stamper and transfer receiving substrate, and the imprint device further includes a positioning center pin which passes through the holes in the imprint stamper and the transfer receiving substrate, and a holding jig which holds the imprint stamper outside a pattern area of the imprint stamper.