SOLID-STATE IMAGING ELEMENT AND MANUFACTURING METHOD THEREOF

1 . A solid-state imaging element comprising:

a photoelectric conversion unit;

a read-out area to which charge from said photoelectric conversion unit is read out;

a charge transferring unit configured to transfer the read-out charge;

a charge transfer electrode which is formed over said charge transferring unit;

shielding film which is formed over said charge transfer electrode and has an opening part over said photoelectric conversion unit; and

anti-reflection film formed (i) in the opening part, and (ii) over said charge transfer electrode, wherein said photoelectric conversion unit, said read-out area, and said charge transferring unit are formed on a substrate, and

(i) a first edge, of said anti-reflection film which is formed in the opening part, stops protruding before reaching spacing found under said shielding film, and (ii) a second edge, of said anti-reflection film which is formed over said charge transfer electrode, stops protruding before covering a side wall of said charge transfer electrode, the first edge facing the side wall of said charge transfer electrode and the second edge protruding in a read-out direction of the charge.

2 . The solid-state imaging element according to claim 1 ,

wherein distance between the first edge and the second edge is 0.20 μm to 0.50 μm.

3 . The solid-state imaging element according to claim 1 ,

wherein silicon-based dielectric film is laminated on said anti-reflection film formed over said charge transfer electrode.

4 . A method for manufacturing a solid-state imaging element which has: a photoelectric conversion unit; a read-out area to which charge from the photoelectric conversion unit is read out; a charge transferring unit which transfers the read-out charge; and a charge transfer electrode which is formed over the charge transferring unit, the photoelectric conversion unit, the read-out area, and the charge transferring unit being formed on a substrate, and said method comprising:

forming anti-reflection film over the photoelectric conversion unit and the charge transfer electrode; and

forming shielding film over the anti-reflection film,

wherein said forming shielding film involves forming an opening part on the shielding film lying over the photoelectric conversion unit, and

in said forming anti-reflection film, (i) a first edge, of the anti-reflection film which is formed over the photoelectric conversion unit, stops protruding before reaching spacing found under the shielding film, and (ii) a second edge, of the anti-reflection film which is formed over the charge transfer electrode, stops protruding before covering a side wall of the charge transfer electrode, the first edge facing the side wall of the charge transfer electrode, and the second edge protruding in read-out direction of the charge.

5 . The method for manufacturing the solid-state imaging element according to claim 4 ,

wherein said forming the anti-reflection film involves repeatedly patterning the anti-reflection film.

6 . The method for manufacturing the solid-state imaging element according to claim 4 ,

wherein said forming the anti-reflection film involves the patterning with a use of partial hard mask including silicon-based dielectric film.

7 . The method for manufacturing the solid-state imaging element according to claim 4 ,

wherein said forming the anti-reflection is carried out using a Low Pressure Chemical Vapor Deposition technique.