Method of fabricating capacitive touch panel
View Patent ↗The present disclosure relates to a method of fabricating a capacitive touch pane where a plurality of groups of first conductive patterns are formed along a first direction, a plurality of groups of second conductive patterns are formed along a second direction, and a plurality of connection components are formed on a substrate. Each first conductive pattern is electrically connected to another adjacent first conductive pattern in the same group by each connection component and each group of the second conductive patterns is interlaced with and insulated from each group of the first conductive patterns. Next, a plurality of curved insulation mounds are formed to cover the first connection components. Then, a plurality of bridge components are formed to electrically connect each second conductive pattern with another adjacent second conductive pattern in the same group.
1. A method of fabricating a touch panel, comprising:
providing a substrate;
forming a first row of first conductive patterns and a second row of said first conductive patterns on said substrate, wherein both said first row of said first conductive patterns and said second row of said first conductive patterns are arranged along a first orientation;
forming a plurality of connection components on said substrate for connecting two neighboring said first conductive patterns in said first row and two neighboring said first conductive patterns in said second row;
forming a plurality of insulation mounds on said substrate, wherein each said insulation mound covers at least a portion of each said connection component; and
forming a third row of second conductive patterns on said substrate in a second orientation and a plurality of bridge components on said plurality of insulation mounds for connecting two neighboring said second conductive patterns in said third row, wherein said second orientation is different from said first orientation, and said third row of said second conductive patterns is insulated from and interlaces with said first row of said first conductive patterns and said second row of said first conductive patterns.
2. The method of claim 1 , wherein step of forming said insulation mounds comprises:
forming a photoresist layer;
forming a plurality of photoresist patterns by performing a lithography process on said photoresist layer, wherein each said photoresist pattern covers each said connection component; and
forming said insulation mounds by performing a baking process on said photoresist patterns.
3. The method of claim 1 , wherein step of forming said insulation mounds comprises:
forming an insulation layer on said substrate;
etching said insulation layer into a plurality of insulation patterns, wherein each said insulation pattern covers each said connection component; and
forming said insulation mounds by performing thermal reflow process on said insulation patterns.
4. The method of claim 1 , wherein step of forming said second conductive patterns and said bridge components comprises:
forming a patterned mask layer, wherein said patterned mask layer comprises a plurality of holes that shrink from bottom to top and each said hole exposes a region desiring to form each said second conductive pattern and each said bridge component;
forming a conductive film on said substrate, wherein said conductive film covers said patterned mask layer and said region desiring to form each said second conductive pattern and each said bridge component; and
removing said patterned mask layer and said conductive film covering said patterned mask layer.
5. The method of claim 4 , wherein step of forming said patterned mask layer comprises:
forming a photoresist layer on said substrate; performing an exposing process on said photoresist layer;
performing a baking process; and
performing a development process on said photoresist layer to form said patterned mask layer.
6. The method of claim 1 , wherein step of forming said first conductive patterns and said connection components comprises:
forming a plurality of auxiliary second conductive patterns in said second orientation, wherein each said second conductive pattern is disposed on each said auxiliary second conductive pattern.
7. The method of claim 6 , wherein step of forming said bridge components and said second conductive patterns comprises:
forming a conductive film on said substrate;
forming a photoresist layer on said conductive film;
providing a photo-etching process to make said conductive film become said second conductive patterns, said bridge components, a plurality of auxiliary first conductive patterns, and a plurality of auxiliary connection components, wherein said auxiliary first conductive patterns are correspondingly formed on said first conductive patterns, and said auxiliary connection components are correspondingly formed on said connection components uncovered by said insulation mounds.