Semiconductor pressure sensor
View Patent ↗A semiconductor pressure sensor includes a cavity disposed in one silicon substrate of a SOI substrate having two silicon substrates bonded to each other with an oxide film therebetween and a diaphragm formed from the other silicon substrate and the oxide film, wherein the oxide film, bordering the cavity, of the diaphragm includes an arc-shaped section at the boundary portion to the one silicon substrate defining the inner wall side surface of the cavity, the arc-shaped section having the same width as the width of the cavity at a desired section in the one silicon substrate and reducing the width of the cavity from the boundary portion toward the diaphragm center.
1. A semiconductor pressure sensor comprising:
a cavity disposed through digging in a one silicon substrate of a SOI (Silicon-On-Insulator) substrate having two silicon substrates bonded to each other with an oxide film therebetween; and
a diaphragm formed from the other silicon substrate and the oxide film,
wherein a periodic uneven section is disposed, in the digging direction, on an inner wall surface of the cavity in the one silicon substrate,
the oxide film, bordering the cavity, of the diaphragm includes an arc-shaped section at a boundary portion to the one silicon substrate defining the inner wall side surface of the cavity, the arc-shaped section having the same width as the width of the cavity at a desired section of the cavity in the one silicon substrate and reducing the width of the cavity from the boundary portion toward the diaphragm center, and
the arc-shaped section is disposed continuously from the periodic uneven section of the one silicon substrate.
2. The semiconductor pressure sensor according to claim 1 , wherein the oxide film, bordering the cavity, of the diaphragm has a thickness reducing from the boundary portion toward the central portion of the diaphragm and has a region with a small thickness.
3. The semiconductor pressure sensor according to claim 1 , wherein the cavity is rectangular in a plan view.
4. The semiconductor pressure sensor according to claim 1 , wherein the arc-shaped section is disposed all around the boundary portion of the cavity.
5. The semiconductor pressure sensor according to claim 1 , wherein on the diaphragm portion of the SOI substrate, sensitive resistance elements are disposed along the outline of the diaphragm in such a way as to constitute a bridge circuit.
6. The semiconductor pressure sensor according to claim 1 , wherein the inner wall side surface of the cavity is disposed almost perpendicularly to the diaphragm.
7. The semiconductor pressure sensor according to claim 1 , wherein the sensitive resistance element is a piezo-resistance element having a resistance value changing in accordance with distortion of the diaphragm.