Method for manufacturing SOI substrate and semiconductor device
It is an object of the present invention to provide a method for manufacturing an SOI substrate having an SOI layer that can be used in practical applications with high yield even when a flexible substrate such as a glass substrate or a plastic substrate is used. Further, it is another object of the present invention to provide a method for manufacturing a thin semiconductor device using such an SOI substrate with high yield. When a single-crystal semiconductor substrate is bonded to a flexible substrate having an insulating surface and the single-crystal semiconductor substrate is separated to manufacture an SOI substrate, one or both of bonding surfaces are activated, and then the flexible substrate having an insulating surface and the single-crystal semiconductor substrate are attached to each other.
1. A method for manufacturing a semiconductor device, comprising:
forming a separation layer over a silicon wafer;
forming an insulating layer over the separation layer;
irradiating a single-crystal semiconductor substrate with a plurality of ions of a single atom to form a fragile region at a predetermined depth in the single-crystal semiconductor substrate;
bonding the single-crystal semiconductor substrate and the insulating layer formed over the silicon wafer to each other
separating the single-crystal semiconductor substrate such that a single-crystal semiconductor layer is left over the silicon wafer;
forming an element layer having a semiconductor element using the single-crystal semiconductor layer;
providing a base substrate having an insulating surface over the element layer; and
separating the silicon wafer from the element layer at the separation layer.
2. A method for manufacturing a semiconductor device, comprising:
forming a separation layer over a glass substrate;
forming an insulating layer over the separation layer;
irradiating a single-crystal semiconductor substrate with a plurality of ions of a single atom to form a fragile region at a predetermined depth in the single-crystal semiconductor substrate;
bonding the single-crystal semiconductor substrate and the insulating layer formed over the glass substrate to each other;
separating the single-crystal semiconductor substrate such that a single-crystal semiconductor layer is left over the glass substrate;
forming an element layer having a semiconductor element using the single-crystal semiconductor layer;
providing a base substrate having an insulating surface over the element layer; and
separating the glass substrate from the element layer at the separation layer.
3. A method for manufacturing a semiconductor device, comprising:
forming a separation layer over a ceramic substrate;
forming an insulating layer over the separation layer;
irradiating a single-crystal semiconductor substrate with a plurality of ions of a single atom to form a fragile region at a predetermined depth in the single-crystal semiconductor substrate;
bonding the single-crystal semiconductor substrate and the insulating layer formed over the ceramic substrate to each other;
separating the single-crystal semiconductor substrate such that a single-crystal semiconductor layer is left over the ceramic substrate;
forming an element layer having a semiconductor element using the single-crystal semiconductor layer;
providing a base substrate having an insulating surface over the element layer; and
separating the ceramic substrate from the element layer at the separation layer.
4. A method for manufacturing a semiconductor device according to claim 1 ,
wherein the separation layer comprises one material selected from the group consisting of tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium and iridium.
5. A method for manufacturing a semiconductor device according to claim 2 ,
wherein the separation layer comprises one material selected from the group consisting of tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium and iridium.
6. A method for manufacturing a semiconductor device according to claim 3 ,
wherein the separation layer comprises one material selected from the group consisting of tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium and iridium.