Semiconductor device having electrical fuses with less power consumption and interconnection arrangement
View Patent ↗In fuse program circuits, fuse element FS is implemented using metal interconnect at third or higher layer of multilayer metal interconnect. In each fuse program circuit, program information and fuse select information are sequentially transferred using a scan flip-flops, and fuses are selectively and electrically blown one by one. The fuse program circuit provided with fuse elements that can be programmed even after packaging is implemented with low power consumption and a low occupation area.
1. A semiconductor device comprising:
(a) a semiconductor substrate,
(b) an internal circuitry having a first transistor element formed over the semiconductor substrate,
(c) at least one fuse program circuit having a second transistor element formed over the semiconductor substrate, the fuse program circuit including a fuse element, and
(d) a plurality of metal interconnection layers formed over the first transistor element and the second transistor element;
wherein the fuse element is formed of the metal interconnection layers and includes copper material,
wherein the second transistor element connected in series to the fuse element is formed for selectively passing a current for blowing the fuse element,
wherein the second transistor element includes a plurality of unit transistors connected in parallel and arranged in a first direction in plan view,
wherein the unit transistors respectively have gate electrodes, source regions and drain regions extending in a second direction perpendicular to the first direction in plan view,
wherein each of the source regions and each of the drain regions are arranged alternately to each other with a space between,
wherein each of the gate electrodes is arranged between the source regions and the drain regions,
wherein a first film material of a first gate insulation film of the first transistor is the same as a second film material of a second gate insulation film of each of the unit transistors, and
wherein a first film thickness of the first gate insulation film is the same as a second film thickness of the second gate insulation film.
2. The semiconductor device according to claim 1 , further comprising:
a plurality of first wiring layers formed of the metal interconnection layers, each of the first wiring layers electrically connected to each of the source regions via each of a plurality of first vias, arranged in the first direction in plan view, and extending in the second direction in plan view;
a plurality of second wiring layers formed of the metal interconnection layers, each of the second wiring layers electrically connected to each of the first wiring layers via each of a plurality of second vias, arranged in the first direction in plan view, and extending in the second direction in plan view;
a plurality of third wiring layers formed of the metal interconnection layers, each of the third wiring layers electrically connected to each of the drain regions via each of a plurality of third vias, arranged in the first direction in plan view, and extending in the second direction in plan view;
a plurality of fourth wiring layers formed of the metal interconnection layers, each of the fourth wiring layers electrically connected to each of the third wiring layers via each of a plurality of fourth vias, arranged in the first direction in plan view, and extending in the second direction in plan view,
wherein each of the second wiring layers overlapping each of the first wiring layers in plan view, and
wherein each of the fourth wiring layers overlapping each of the third wiring layers in plan view.
3. The semiconductor device according to claim 2 ,
wherein the first wiring layers and the second are the lowest wiring layers.
4. The semiconductor device according to claim 1 , further comprising:
a first pad to which a first power supply voltage from outside of the semiconductor device is provide, the first power supply voltage provided to the internal circuit; and
a second pad to which a second power supply voltage from outside of the semiconductor device is provide, the second power supply voltage being different from the first power supply voltage, the second power supply voltage provided to one terminal of the fuse element.
5. The semiconductor device according to claim 4 , wherein a pad to which the second power supply voltage from outside of the semiconductor device is provided doesn't exist except for the second pad.