IP Library Granted Patent US 8,203,824
Granted Patent B2
US 8,203,824 · App. 12/723,831 · Granted Jun 19, 2012

Electrical multilayer component

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Quick Facts
Patent No.
US 8,203,824
App. No.
12/723,831
Granted
Jun 19, 2012
Kind
B2
Abstract

An electrical multilayer component has a stack of dielectric layers and electrode layers arranged one above another. An electrically insulating stiffening element is arranged at a distance from at least one electrode layer on the same dielectric layer as the electrode layer. The stiffening element preferably has an increased flexural strength with respect to dielectric material surrounding it.

Claims (28)

1. An electrical multilayer component comprises:

a stack of dielectric layers and electrode layers arranged one above another; and

an electrically insulated stiffening element arranged at a distance from an electrode layer and on the same dielectric layer as that electrode layer, wherein the stiffening element has an increased flexural strength with respect to dielectric material surrounding the stiffening element.

2. The multilayer component as claimed in claim 1 , wherein the stiffening element has a higher flexural strength than the electrode layer arranged on the same dielectric layer.

3. The multilayer component as claimed in either of claim 1 , wherein the stiffening element comprises electrically insulating material.

4. The multilayer component as claimed in claim 3 , wherein the stiffening element comprises ceramic material.

5. The multilayer component as claimed in claim 1 , wherein the stiffening element comprises an electrically conductive material and is electrically insulated from the electrode layer on the same dielectric layer.

6. The multilayer component as claimed in claim 5 , wherein the stiffening element comprises the same material as the electrode layers.

7. The multilayer component as claimed in claim 1 , wherein the stiffening element extends in the longitudinal direction alongside a longitudinal side of the electrode layer on the same dielectric layer.

8. The multilayer component as claimed in claim 1 , wherein the stiffening element comprises one of a plurality of stiffening elements arranged along a longitudinal side of the electrode layer.

9. The multilayer component as claimed in claim 1 , wherein the stiffening element is applied as a layer to a dielectric layer.

10. The multilayer component as claimed in claim 1 , wherein the stiffening element is buried in a dielectric layer.

11. The multilayer component as claimed in claim 1 , wherein the stiffening element comprises a strip.

12. The multilayer component as claimed in claim 1 , further comprising a first external contact disposed on a first side surface of the stack and a second external contact disposed on a second side of the stack, each external contact making contact with respective ones of the electrode layers.

13. The multilayer component as claimed in claim 1 , wherein the dielectric layers contain a capacitor ceramic.

14. The multilayer component as claimed in claim 13 , wherein the multilayer component comprises a multilayer capacitor.

15. The multilayer component as claimed in claim 1 , wherein the dielectric layers contain a varistor ceramic.

16. The multilayer component as claimed in claim 15 , wherein the multilayer component comprises a multilayer varistor.

17. The multilayer component as claimed in claim 1 , further comprising a second stack of electrode layers and dielectric layers arranged one above another, wherein the dielectric layers of the stack contains a different functional ceramic as the dielectric layers of the second stack.

18. The multilayer component as claimed in claim 17 , wherein the stack comprises a multilayer capacitor.

19. The multilayer component as claimed in claim 18 , wherein the second stack comprises a multilayer varistor.

20. The multilayer component as claimed in claim 17 , wherein the stack and the second stack are arranged laterally alongside one another.

21. The multilayer component as claimed in claim 17 , wherein the stack and the second stack are arranged one above another.

22. The multilayer component as claimed in claim 1 , wherein the dielectric layers, electrode layers and the stiffening element are combined to form a monolithic body.

23. The multilayer component as claimed in claim 1 , further comprising a ground electrode disposed on at least one dielectric layer, the ground electrode being contact-connected to a ground contact arranged at a side surface of the multilayer component.

24. The multilayer component as claimed in claim 1 , wherein the electrode layers comprise at least one material selected from the group consisting of silver, palladium, nickel, and copper.

25. The multilayer component as claimed in claim 1 , wherein an outer surface of the stack is at least partly passivated.

26. The multilayer component as claimed in claim 25 , further comprising a glass-containing layer, wherein the outer surface of the stack is coated with the glass-containing layer.

Assignments (2)
CHANGE OF NAME Recorded Mar 15, 2023
From: EPCOS AG
To: TDK ELECTRONICS AG
Reel/Frame 063101/0709 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 6, 2010
From: PECINA, AXEL; SCHLAUER, GERALD; FEIEL, GERNOT
To: EPCOS AG
Reel/Frame 024348/0322 →