IP Library Granted Patent US 8,558,231
Granted Patent B2
US 8,558,231 · App. 12/724,047 · Granted Oct 15, 2013

Array substrate and method of manufacturing the same

Inventors: Youngsuk Song (Beijing, CN); Seungjin Choi (Beijing, CN); Seongyeol Yoo (Beijing, CN)
Assignee: Beijing BOE Optoeletronics Co., Ltd.
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Quick Facts
Patent No.
US 8,558,231
App. No.
12/724,047
Granted
Oct 15, 2013
Kind
B2
Abstract

The present invention provides an array substrate comprising: a substrate, having a thin film transistor (TFT) formed thereupon, the TFT having a gate electrode, a source electrode and a drain electrode; a first metal layer, formed on the substrate, and comprising a gate line and the gate electrode of the TFT; a first insulating layer, covering the first metal layer and the substrate; a semiconductor layer, an ohmic contact layer, and a second metal layer, which are sequentially formed on the first insulating layer; a second insulating layer, covering the semiconductor layer, the ohmic contact layer, and the second metal layer; a pixel electrode, provided on the second insulating layer and is connected to the drain electrode. The second metal layer further comprises an etch-blocking pattern in the peripheral area of the pixel electrode within the overlapping region between the pixel electrode and the first metal layer.

Claims (14)

1. An array substrate, comprising:

a substrate having a thin film transistor (TFT) formed thereupon, the TFT having a gate electrode, a source electrode, and a drain electrode;

a first metal layer formed on the substrate and comprising a gate line and the gate electrode of the TFT;

a first insulating layer covering the first metal layer and the substrate;

a semiconductor layer, an ohmic contact layer, and a second metal layer, which are sequentially formed on the first insulating layer, wherein the second metal layer comprises a data line and the source electrode and the drain electrode of the TFT, a lamination of the semiconductor layer and the ohmic contact layer constitutes an active layer, and the data line is connected to the source electrode of the TFT;

a second insulating layer covering the semiconductor layer, the ohmic contact layer, and the second metal layer; and

a pixel electrode provided on the second insulating layer and connected to the drain electrode,

wherein the second metal layer further comprises an etch-blocking pattern in a peripheral area of the pixel electrode within an overlapping region between the pixel electrode and the first metal layer, and the etch-blocking pattern is interposed between the active layer and the pixel electrode.

2. The array substrate according to claim 1 , wherein the etch-blocking pattern in the second metal layer is further formed in the pixel electrode's peripheral area that is adjacent to the data line.

3. The array substrate according to claim 1 , wherein the etch-blocking pattern in the second metal layer is evenly arranged in the peripheral area of the pixel electrode.

4. The array substrate according to claim 1 , wherein the first metal layer further comprises a common electrode line.

5. The array substrate according to claim 4 , wherein the etch-blocking pattern in the second metal layer is further formed in an overlapping region between the pixel electrode and the common electrode line.

6. The array substrate according to claim 4 , wherein the etch-blocking pattern in the second metal layer is evenly arranged in the peripheral area of the pixel electrode.

7. The array substrate according to claim 4 , wherein the common electrode line extends parallel with the gate line.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2015
From: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD
To: BOE TECHNOLOGY GROUP CO., LTD.; BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO. LTD
Reel/Frame 036644/0601 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2010
From: SONG, YOUNGSUK; CHOI, SEUNGJIN; YOO, SEONGYEOL
To: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 024083/0864 →
Priority Claims (1)
CN 2009 1 0080227 · Mar 16, 2009 · national
Continuity (1)
Related Publication 20100230682A1 · Sep 16, 2010