Method for vapor deposition
View Patent ↗Chemical vapor deposition (CVD) processes include, in one embodiment, a method for processing a wafer within a vapor deposition reactor comprising heating at least one wafer disposed on a wafer carrier by exposing a lower surface of the wafer carrier to radiation emitted from a lamp assembly and flowing a liquid through a passageway extending throughout the reactor to maintain the reactor lid assembly at a predetermined temperature, such as within a range from about 275° C. to about 325° C. The method further includes traversing the wafer carrier along a wafer carrier track through at least a chamber containing a showerhead assembly and an isolator assembly and another chamber containing a showerhead assembly and an exhaust assembly, and removing gases from the reactor through the exhaust assembly.
1. A method for processing a wafer within a vapor deposition reactor, comprising:
heating at least one wafer disposed on a wafer carrier by exposing a lower surface of a wafer carrier track to radiation emitted from a lamp assembly, wherein the wafer carrier is disposed on the wafer carrier track within a vapor deposition reactor;
flowing at least one liquid from at least one heat exchanger to a liquid supply through passageways extending throughout a reactor lid assembly and a reactor body assembly of the vapor deposition reactor and to at least one liquid return to maintain the reactor lid assembly at a first temperature and the reactor body assembly at a second temperature, wherein the liquids and the passageways are in fluid communication with a temperature regulation system, the temperature regulation system including the at least one heat exchanger, the at least one liquid supply and the at least one liquid return all in fluid communication;
traversing the wafer carrier along the wafer carrier track through a first chamber comprising a first showerhead assembly and an isolator assembly;
exposing the wafer to a first mixture of gaseous precursors flowing from the first showerhead while depositing a first material;
exposing the wafer to a process gas flowing from the isolator assembly;
traversing the wafer carrier along the wafer carrier track through a second chamber comprising a second showerhead assembly and an exhaust assembly;
exposing the wafer to a second mixture of gaseous precursors flowing from the second showerhead while depositing a second material; and
removing gases from the vapor deposition reactor through the exhaust assembly.
2. The method of claim 1 , wherein each of the first temperature and the second temperature is independently within a range from about 275° C. to about 325° C.
3. The method of claim 2 , wherein each of the first temperature and the second temperature is independently within a range from about 290° C. to about 310° C.
4. The method of claim 3 , wherein each of the first temperature and the second temperature is independently about 300° C.
5. The method of claim 1 , wherein a reflector is disposed below the lamp assembly.
6. The method of claim 5 , wherein the lower surface of the wafer carrier track is exposed to radiation emitted from the lamp assembly and reflected from the reflector.
7. The method of claim 5 , wherein the reflector comprises gold or a gold alloy.
8. The method of claim 1 , further comprising levitating the wafer carrier from the wafer carrier track and traversing the wafer carrier along the wafer carrier track.
9. The method of claim 8 , further comprising levitating the wafer carrier by exposing a lower surface of the wafer carrier to a levitating gas flowing from a plurality of holes disposed on an upper surface of the wafer carrier track.
10. The method of claim 1 , wherein the process gas comprises a gas selected from the group consisting of arsine, argon, helium, nitrogen, hydrogen, and mixtures thereof.
11. The method of claim 10 , wherein the process gas comprises arsine.
12. The method of claim 1 , wherein the first precursor comprises an aluminum precursor, a gallium precursor, an indium precursor, or mixtures thereof.
13. The method of claim 12 , wherein the second precursor comprises a nitrogen precursor, a phosphorus precursor, an arsenic precursor, an antimony precursor, or mixtures thereof.
14. A method for processing a wafer within a vapor deposition reactor, comprising:
heating at least one wafer disposed on a wafer carrier by exposing a lower surface of a wafer carrier track to radiation emitted from a lamp assembly, wherein the wafer carrier is disposed on the wafer carrier track within a vapor deposition reactor;
flowing a liquid from a heat exchanger to a liquid supply through a passageway extending throughout a reactor lid assembly or a reactor body assembly of the vapor deposition reactor and to at least one liquid return to maintain the reactor lid assembly or the reactor body assembly at a predetermined temperature, wherein the liquid and the passageway are in fluid communication with a temperature regulation system, the temperature regulation system including the heat exchanger, the liquid supply and the liquid return all in fluid communication;
traversing the wafer carrier along the wafer carrier track through at least two chambers, wherein a first chamber comprises a first showerhead assembly and an isolator assembly and a second chamber comprises a second showerhead assembly and an exhaust assembly; and
removing gases from the vapor deposition reactor through the exhaust assembly.
15. The method of claim 14 , wherein the predetermined temperature of the reactor lid assembly is within a range from about 275° C. to about 325° C.
16. The method of claim 15 , wherein the predetermined temperature of the reactor lid assembly is within a range from about 290° C. to about 310° C.
17. The method of claim 16 , wherein the predetermined temperature of the reactor lid assembly is about 300° C.
18. The method of claim 14 , wherein the predetermined temperature of the reactor body assembly is within a range from about 275° C. to about 325° C.
19. The method of claim 18 , wherein the predetermined temperature of the reactor body assembly is within a range from about 290° C. to about 310° C.
20. The method of claim 19 , wherein the predetermined temperature of the reactor body assembly is about 300° C.