ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING THE SAME, AND JOINED STRUCTURE USING THE SAME
An anisotropic conductive film, containing a resin film; and conductive particles aligned into a monolayer within the resin film adjacent to or on one plane of the resin film with respect to a thickness direction of the resin film, wherein a distance between the one plane of the resin film and a center of the conductive particle is 9 μm or less based on 10-point average.
1 . An anisotropic conductive film, comprising:
a resin film; and
conductive particles aligned into a monolayer within the resin film adjacent to or on one plane of the resin film with respect to a thickness direction of the resin film,
wherein a distance between the one plane of the resin film and a center of the conductive particle is 9 μm or less based on 10-point average.
2 . The anisotropic conductive film according to claim 1 , wherein a distance between a center of the conductive particle and a center of the adjacent conductive particle is 1 μm to 30 μm based on 10-point average.
3 . The anisotropic conductive film according to claim 1 , wherein the anisotropic conductive film is obtained by simultaneously spraying the conductive particles, to which electrostatic potential is applied by an electrostatic potential applying unit, by means of one spraying unit, and resin particles by means of another spraying unit onto a processing surface so as to align the conductive particles into a monolayer within the resin film formed of the resin particles.
4 . The anisotropic conductive film according to claim 1 , wherein the resin film is formed of at least one insulating resin selected from an epoxy resin and an acrylic resin.
5 . A joined structure, comprising:
an anisotropic conductive film; and
at least two members selected from electronic parts and substrates,
wherein the at least two members are electrically joined via the anisotropic conductive film, and
wherein the anisotropic conductive film, comprising:
a resin film; and
conductive particles aligned into a monolayer within the resin film adjacent to or on one plane of the resin film with respect to a thickness direction of the resin film,
wherein a distance between the one plane of the resin film and a center of the conductive particle is 9 μm or less based on 10-point average.
6 . The joined structure according to claim 5 , wherein the at least two members selected from the electronic parts and the substrates have a connection terminal having an area in the range of 600 μm 2 or more but less than 1,800 μm 2 .
7 . The joined structure according to claim 5 , wherein the electronic part is selected from IC chip and a liquid crystal display panel, and the substrate is selected from ITO glass substrate, a flexible substrate, a rigid substrate, and a flexible print substrate.
8 . A method for producing an anisotropic conductive film, comprising:
simultaneously spraying conductive particles, to which electrostatic potential is applied by means of an electrostatic potential applying unit, from one spraying unit, and resin particles from another spraying unit on a processing surface so as to align the conductive particles within a resin film formed of the resin particles.
9 . The method for producing an anisotropic conductive film according to claim 8 , wherein the resin particles are formed of at least one insulating resin selected from an epoxy resin and an acrylic resin.
10 . The method for producing an anisotropic conductive film according to claim 8 , wherein the electrostatic potential of the conductive particles is in the range of 300 V to 1,500 V.
11 . The method for producing an anisotropic conductive film according to claim 8 , wherein the conductive particles sprayed from the spraying unit travel to the processing surface at the speed of 0.3 m/min or slower.
12 . The method for producing an anisotropic conductive film according to claim 8 , wherein the spraying unit contains a nozzle.
13 . The method for producing an anisotropic conductive film according to claim 12 , wherein the nozzle has a diameter of 0.1 mm to 1.0 mm.
14 . The method for producing an anisotropic conductive film according to claim 8 , wherein a distance between a center of the conductive particle and a center of the adjacent conductive particle in the resin film is 1 μm to 30 μm based on 10-point average.
15 . The method for producing an anisotropic conductive film according to claim 8 , wherein a distance between a center of the conductive particle in the resin film and the processing surface is 9 μm or less based on 10-point average.
16 . The method for producing an anisotropic conductive film according to claim 8 , wherein the processing surface has a conductive pattern, and the conductive particles are selectively aligned on the conductive pattern.