Low sintering temperature glass waste forms for sequestering radioactive iodine
Materials and methods of making low-sintering-temperature glass waste forms that sequester radioactive iodine in a strong and durable structure. First, the iodine is captured by an adsorbant, which forms an iodine-loaded material, e.g., AgI, AgI-zeolite, AgI-mordenite, Ag-silica aerogel, ZnI 2 , CuI, or Bi 5 O 7 I. Next, particles of the iodine-loaded material are mixed with powdered frits of low-sintering-temperature glasses (comprising various oxides of Si, B, Bi, Pb, and Zn), and then sintered at a relatively low temperature, ranging from 425° C. to 550° C. The sintering converts the mixed powders into a solid block of a glassy waste form, having low iodine leaching rates. The vitrified glassy waste form can contain as much as 60 wt % AgI. A preferred glass, having a sintering temperature of 500° C. (below the silver iodide sublimation temperature of 500° C.) was identified that contains oxides of boron, bismuth, and zinc, while containing essentially no lead or silicon.
1. An iodine-loaded waste form, comprising a glassy body comprised of a mixture of a LST (Low-Sintering-Temperature) glass and an iodine-loaded material;
wherein the LST glass has a sintering temperature that ranges from 425° C. to 550° C.;
wherein the LST glass comprises bismuth oxide and at least one element selected from the group consisting of oxides of Pb, Bi, Zn and B; and
wherein the iodine-loaded material is selected from the group consisting of AgI, AgI-zeolite, Ag-silica aerogel, ZnI 2 , CuI, and a bismuth-oxy-iodine compound having a thermal decomposition temperature greater than the sintering temperature of the LST glass.
2. The iodine-loaded waste form of claim 1 , wherein the iodine comprises radioactive iodine.
3. The iodine-loaded waste form of claim 1 , wherein the LST glass comprises boron and bismuth.
4. The iodine-loaded waste form of claim 3 , wherein the LST glass comprises boron, bismuth, and zinc; and has a sintering temperature of about 500° C.
5. The iodine-loaded waste form of claim 4 , wherein the LST glass comprises 51-55 wt % Bi, 21-22 wt % Zn, and 3-4 wt % B, with the remainder comprising O, and comprising essentially no lead or silicon.
6. The iodine-loaded waste form of claim 5 , wherein the iodine-loaded material comprises AgI-zeolite, and the zeolite comprises Mordenite zeolite.
7. The iodine-loaded waste form of claim 1 , wherein the iodine-loaded material comprises AgI, and the concentration of AgI in the waste form ranges from 20 wt % to 60 wt % AgI.
8. The iodine-loaded waste form of claim 1 , wherein the AgI is homogeneously dissolved throughout the iodine-loaded waste form.
9. The iodine-loaded waste form of claim 1 , wherein the iodine-loaded material comprises AgI-zeolite, and the zeolite comprises Mordenite zeolite.
10. The iodine-loaded waste form of claim 1 , wherein the iodine-loaded material comprises a bismuth-oxy-iodine compound having a thermal decomposition temperature greater than 550° C.
11. The iodine-loaded waste form of claim 10 , wherein the bismuth-oxy-iodine compound comprises Bi 5 O 7 I.
12. The iodine-loaded waste form of claim 1 , wherein the iodine-loaded waste form is surrounded by a protective coating comprising Bi 2 O 3 .
13. The iodine-loaded waste form of claim 1 , wherein the iodine-loaded waste form is surrounded by a protective coating comprising Bi 5 O 7 I.
14. An iodine-loaded waste form, comprising a glassy body comprised of a mixture of a LST (Low-Sintering-Temperature) glass and an iodine-loaded material;
wherein the LST glass comprises 51-55 wt % Bi, 21-22 wt % Zn, and 3-4 wt % B, with the remainder comprising O, and comprising essentially no lead or silicon;
wherein the LST glass has a sintering temperature of about 500° C.;
wherein the iodine-loaded material comprises AgI-zeolite; and
wherein the zeolite comprises Mordenite zeolite.
15. A method of forming a glassy iodine-loaded waste form, comprising:
a) mixing powdered frits of a LST (Low-Sintering-Temperature) glass with particles or powders of an iodine-loaded material, wherein the LST glass comprises bismuth oxide and at least one element selected from the group consisting of oxides of Pb, Bi, Zn and B; and wherein the iodine-loaded material is selected from the group consisting of AgI, AgI-zeolite, Ag-silica aerogel, ZnI 2 , CuI, and a bismuth-oxy-iodine compound having a thermal decomposition temperature greater than the sintering temperature of the LST glass.
b) heating the mixture in an oxidizing environment at a temperature that ranges from 425° C. to 550° C., which sinters and densifies the mixture; and then
c) cooling the sintered mixture.
16. The method of claim 15 , wherein the iodine comprises radioactive iodine.
17. The method of claim 15 , wherein the LST glass comprises boron and bismuth.
18. The method of claim 17 , wherein the LST glass comprises boron, bismuth, and zinc; and has a sintering temperature of about 500° C.
19. The method of claim 15 , wherein the concentration of AgI in the waste form ranges from 20 wt % to 60 wt % AgI.
20. The method of claim 15 , wherein the LST glass comprises 51-55 wt % Bi, 21-22 wt % Zn, and 3-4 wt % B, with the remainder comprising O, and comprising essentially no lead or silicon.
21. The method of claim 20 , wherein the iodine-loaded material comprises AgI-zeolite, and the zeolite comprises Mordenite zeolite.
22. The method of claim 15 , wherein the AgI is homogeneously dissolved throughout the iodine-loaded waste form.
23. The method of claim 15 , wherein the iodine-loaded material comprises AgI-zeolite, and the zeolite comprises Mordenite zeolite.
24. The method of claim 15 , wherein the iodine-loaded material comprises a bismuth-oxy-iodine compound having a thermal decomposition temperature greater than 550° C.
25. The method of claim 15 , wherein the bismuth-oxy-iodine compound comprises Bi 5 O 7 I.
26. The method of claim 15 , further comprising after step c) surrounding the glassy iodine-loaded waste form with a protective coating comprising Bi 2 O 3 .
27. The method of claim 15 , further comprising after step c) surrounding the glassy iodine-loaded waste form with a protective coating comprising Bi 5 O 7 I.