Apparatus, system, and method of power supply disposition and cooling

1. An apparatus comprising:

a power supply disposed adjacent a first end of a chassis, the chassis comprising a vertical z axis from the first end to a second end of the chassis and an x axis orthogonal to the z axis;

a bay disposed adjacent the first end of the chassis along the x axis from the power supply, the bay comprising at least one storage device;

a chamber disposed adjacent the first end of the chassis adjacent the bay along the x axis between the bay and the power supply;

a first fan disposed adjacent the first end of the chassis between the power supply and the chamber along the x axis and motivating a first airflow along the x axis; and

a first baffle disposed offset from the power supply, the bay, and the chamber along the z axis toward the second end, the first baffle forming a first section isolating the first airflow in the first section from a second airflow.

2. The apparatus of claim 1 , further comprising components disposed within the chassis offset from the power supply along the z axis toward the second end such that no components overlap the power supply along the z axis.

3. The apparatus of claim 2 , the components comprising a motherboard disposed parallel with a chassis wall in a plane parallel a plane of the x and z axes.

4. The apparatus of claim 2 , the components comprising first components and second components, the second components offset from the first components along the z axis toward the second end.

5. The apparatus of claim 4 , further comprising a second baffle disposed between the second components and the first components, the first baffle and the second baffle forming a second section comprising the first components and the second baffle forming a third section comprising the second components, the second baffle isolating the second airflow of the second section from a third airflow of the third section.

6. The apparatus of claim 5 , the second components comprising an optical disk drive and at least a processor portion and a memory portion of the motherboard.

7. The apparatus of claim 1 , wherein a width of the chassis along a y axis orthogonal to the x and z axes is in the range of 12.5 to 13.34 centimeters.

8. The apparatus of claim 1 , wherein the storage device is a hard disk drive.

9. A system comprising:

a power supply disposed adjacent a bottom of a chassis, the chassis comprising a vertical z axis from the bottom to a top of the chassis and an x axis orthogonal to the z axis;

a bay disposed adjacent the bottom of the chassis along the x axis from the power supply, the bay comprising at least one storage device;

a chamber disposed adjacent the bottom of the chassis adjacent the bay along the x axis between the bay and the power supply;

a first fan disposed adjacent the first end of the chassis between the power supply and the chamber along the x axis and motivating a first airflow along the x axis; and

components disposed within the chassis offset from the power supply along the z axis toward the top such that no components overlap the power supply along the z axis.

10. The system of claim 9 , the components comprising first components and second components, the second components offset from the first components along the z axis toward the top.

11. The system of claim 10 , further comprising a first baffle disposed offset from the power supply, the bay, and the chamber along the z axis toward the top, the first baffle forming a first section isolating a first airflow in the first section from a second airflow, and a second baffle disposed between the second components and the first components, the first baffle and the second baffle forming a second section comprising the first components and the second baffle forming a third section comprising the second components, the second baffle isolating the second airflow of the second section from a third airflow of the third section.

12. The system of claim 9 , wherein a width of the chassis along a y axis orthogonal to the x and z axes is in the range of 12.5 to 13.34 centimeters.

13. The system of claim 9 , the components comprising an Advanced Technology Extended (ATX) form factor motherboard as specified Mar. 23, 2010.

14. A method comprising:

disposing a power supply adjacent a first end of a chassis, the chassis comprising a vertical z axis from the first end to a second end of the chassis and an x axis orthogonal to the z axis;

disposing a bay adjacent the first end of the chassis along the x axis from the power supply, the bay comprising at least one storage device;

disposing a chamber adjacent the first end of the chassis adjacent the bay along the x axis between the bay and the power supply; and

disposing a first fan adjacent the first end of the chassis between the power supply and the chamber along the x axis and motivating a first airflow along the x axis with the first fan;

disposing a first baffle offset from the power supply, the bay, and the chamber along the z axis toward the second end, the first baffle forming a first section isolating the first airflow in the first section from a second airflow.

15. The method of claim 14 , further comprising disposing components within the chassis offset from the power supply along the z axis toward the second end such that no components overlap the power supply along the z axis.

16. The method of claim 15 , the components comprising first components and second components, the second components offset from the first components along the z axis.

17. The method of claim 16 , further comprising disposing a second baffle between the second components and the first components, the first baffle and the second baffle forming a second section comprising the first components and the second baffle forming a third section comprising the second components, the second baffle isolating the second airflow of the second section from a third airflow of the third section.