Method of manufacturing thin film capacitor and thin film capacitor
View Patent ↗A method of manufacturing a thin film capacitor, having: a base electrode; dielectric layers consecutively deposited on the base electrode; an internal electrode deposited between the dielectric layers; an upper electrode deposited opposite the base electrode with the dielectric layers and the internal electrode being interposed therebetween; and a cover layer deposited on the upper electrode, has depositing an upper electrode layer which is to be the upper electrode, and a cover film which is to be the cover layer on the unsintered dielectric film which is to be the dielectric layer, to fabricate a lamination component, and sintering the lamination component.
1. A thin film capacitor, comprising a base electrode, a dielectric layer deposited on the base electrode, an upper electrode deposited opposite the base electrode with the dielectric layer being interposed therebetween, and a cover layer deposited on the upper electrode,
wherein the thin film capacitor is formed by sintering a lamination component; and
wherein the lamination component is formed by depositing an upper electrode layer which is to be the upper electrode and a cover film which is to be the cover layer on an unsintered dielectric film which is to be the dielectric layer.
2. The thin film capacitor according to claim 1 , wherein the cover layer comprises material of the same composition as the dielectric layer.
3. The thin film capacitor according to claim 1 , further comprising a terminal electrode, which is provided after patterning the sintered lamination component.