Method of cutting substrate
View Patent ↗A substrate cutting method includes the steps of aligning a panel including two or more substrates, along a cutting line, forming groove lines in the respective substrates of the panel along the cutting line, by oscillating respective ultraviolet UV laser beams along the cutting line, and cutting the panel along the groove lines, by applying force to the panel.
1. A substrate cutting method, comprising:
oscillating ultraviolet laser beams on first and second substrates of a panel along first and second cutting lines to form first and second groove lines in the first and second substrates, respectively; and
dividing the panel at the first and second groove lines by applying a force to the panel;
wherein oscillating the ultraviolet laser beams includes oscillating a first laser beam on a first beam irradiation section of the first substrate and simultaneously oscillating a second laser beam on a second beam irradiation section of the second substrate, the second beam irradiation section overlapping the first beam irradiation section when viewed in a direction orthogonal to planes of the first and second substrates.
2. The substrate cutting method of claim 1 , wherein:
the first and second groove lines are formed in first surfaces of the respective first and second substrates, and the first surfaces of the first and second substrates face the same direction; and
the first and second groove lines overlap each other when viewed in a direction orthogonal to planes of the first surfaces.
3. The substrate cutting method of claim 2 , wherein the force is applied to a second surface of one of the substrates, the second surface facing an opposite side as the first surfaces.
4. The substrate cutting method of claim 2 , wherein the first and second beam irradiation sections are sections of the respective first and second cutting lines, and oscillating the ultraviolet laser beams includes
moving the first and second beam irradiation sections along the respective first and second cutting lines.
5. The substrate cutting method of claim 4 , wherein the first and second laser beams have a wavelength of from about 200 nm to about 900 nm.
6. The substrate cutting method of claim 4 , wherein:
the first and second laser beams are pulsed; and
the first and second laser beams form the first and second groove lines by removing portions of the first and second substrates, respectively.
7. The substrate cutting method of claim 6 , wherein the first and second laser beams have a unit irradiation time of less than about 50 picoseconds.
8. The substrate cutting method of claim 6 , wherein the first and second laser beams have a pulse frequency of from about 0.1 MHz to about 100 MHz.
9. The substrate cutting method of claim 3 , wherein dividing the panel includes disposing a buffer member on the second surface of one of the substrates.
10. The substrate cutting method of claim 1 , wherein oscillating the ultraviolet laser beams includes using different focal distances for each of the first and second laser beams.
11. The substrate cutting method of claim 1 , wherein:
the first substrate is a glass substrate;
the second substrate is a glass substrate disposed to face the first substrate; and
sealants bond the first substrate to the second substrate.
12. The substrate cutting method of claim 1 , further comprising inverting the panel on a stage prior to the dividing of the panel.
13. The substrate cutting method of claim 1 , wherein oscillating the first laser beam includes the first laser beam passing through the second substrate.
14. The substrate cutting method of claim 1 , wherein oscillating the first and second laser beams includes varying an angle of incidence of the first and second laser beams on the first and second substrates, respectively.
15. The substrate cutting method of claim 1 , wherein the first and second laser beams are oscillated at a speed of about 0.1 m/s to about 10 m/s.
16. A substrate cutting method, comprising:
oscillating ultraviolet laser beams on substrates of a panel along cutting lines to form groove lines in the substrates;
dividing the panel at the groove lines by applying a force to the panel; and
inverting the panel on a stage prior to the dividing of the panel;
wherein:
the groove lines are formed in first surfaces of the substrates, the first surfaces facing the same direction;
the groove lines overlap each other when viewed in a direction orthogonal to planes of the first surfaces;
the force is applied to an opposing second surface of one of the substrates;
the oscillating of the laser beams includes:
oscillating the laser beams within beam irradiation sections of each of the cutting lines, and
moving the beam irradiation sections along the respective cutting lines;
the laser beams have a wavelength of from about 200 nm to about 900 nm;
the laser beams are pulsed;
the laser beams form the groove lines by removing portions of the substrates;
the laser beams have a unit irradiation time of less than about 50 picoseconds;
the laser beams have a pulse frequency of from about 0.1 MHz to about 100 MHz;
the dividing of the panel includes disposing a buffer member on an opposing second surface of one of the substrates;
the oscillating of the laser beams includes using different focal distances for each of the laser beams;
the panel includes:
a first glass substrate,
a second glass substrate disposed to face the first glass substrate, and
sealants to bond the first glass substrate to the second glass substrate; and
the oscillating of the laser beams includes:
oscillating a first laser beam on the first glass substrate,
forming a first groove line in the first glass substrate using the first laser beam,
oscillating a second laser beam on the second glass substrate, and
forming a second groove line in the second glass substrate using the second laser beam.