IP Library Granted Patent US 8,362,370
Granted Patent B2
US 8,362,370 · App. 12/733,952 · Granted Jan 29, 2013

Electronic circuit board and electronic circuit board shield method and construction

Inventor: Kazuto Satou (Tokyo, JP)
Assignee: NEC Display Solutions, Ltd.
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Quick Facts
Patent No.
US 8,362,370
App. No.
12/733,952
Granted
Jan 29, 2013
Kind
B2
Abstract

The present invention has the object of providing a technology that can facilitate inexpensive shields of individual electronic components with good heat exchange efficiency, the electronic circuit board according to the present invention being provided with: a plurality of conductor parts in a standing state that can extend and contract on a ground pattern that surrounds an electronic component on the electronic circuit board, a conductive plate, and securing members for holding the plate such that the plurality of conductor parts contact the plate in a state in which the conductor parts contract from their natural length.

Claims (13)

1. An electronic circuit board, comprising:

a plurality of conductor parts that extends and contracts, and is arranged in a standing state on a ground pattern that surrounds an electronic component on the electronic circuit board;

a conductive plate which covers an entirety of a surface of an electronic component mounted side of said electronic circuit board, and which is brought into electrical contact with said ground pattern by said conductor parts; and

securing members arranged in a circumference of said electronic circuit board, for holding said conductive plate such that said plurality of conductor parts contacts said plate in a state in which said conductor parts contract from their natural length;

wherein said plurality of conductor parts is arranged on an inside of the circumference by said securing members for an area bounded by said plurality of conductor parts which becomes smaller than an area bounded by said conductive plate, and said plurality of conductor parts is positioned to stand adjacent to a location whose value is not greater than a value determined according to electromagnetic waves radiated by the electronic component.

2. A shield method of an electronic circuit board, said method comprising:

providing, in a standing state, a plurality of conductor parts that extends and contracts on a ground pattern that surrounds an electronic component on an electronic circuit board; and

securing a conductive plate which covers an entirety of a surface of an electronic component mounted side of said electronic circuit board, and which is brought into electrical contact with said ground pattern by said conductor parts, by securing members arranged on a circumference of said electronic circuit board, such that said plurality of conductor parts contacts said plate in a state in which said conductor parts contract from their natural length,

wherein said plurality of conductor parts is arranged on an inside of a circumference by said securing members for an area bounded by said plurality of conductor parts which becomes smaller than an area bounded by said conductive plate, and said plurality of conductor parts are positioned to stand adjacent to a location whose value is not greater than a value determined according to electromagnetic waves radiated by the electronic component.

3. A shield method of an electronic circuit board, said method comprising:

providing, in a standing state, a plurality of conductor parts that extends and contracts on a ground pattern that surrounds an electronic component on an electronic circuit board; and

securing the electronic circuit board by securing members such that said plurality of conductor parts contacts a conductive plate which covers an entire surface of an electronic component mounted side of said electronic circuit board, and which is brought into electrical contact with said ground pattern by said conductor parts, by securing members arranged in a circumference of said electronic circuit board, in a state in which said conductor parts contract from their natural length,

wherein said plurality of conductor parts is arranged on an inside of the circumference by said securing members for an area bounded by said plurality of conductor parts which becomes smaller than an area bounded by said conductive plate, and said plurality of conductor parts is positioned to stand adjacent to a location whose value is not greater than a value determined according to electromagnetic waves radiated by the electronic component.

Assignments (2)
CHANGE OF NAME Recorded Feb 8, 2021
From: NEC DISPLAY SOLUTIONS, LTD.
To: SHARP NEC DISPLAY SOLUTIONS, LTD.
Reel/Frame 055256/0755 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2010
From: SATOU, KAZUTO
To: NEC DISPLAY SOLUTIONS, LTD.
Reel/Frame 024190/0954 →
Priority Claims (1)
JP 2007-304384 · Nov 26, 2007 · national
Continuity (1)
Related Publication 20100230153A1 · Sep 16, 2010