Semiconductor device
View Patent ↗The object of the present invention is to efficiently dissipate heat from the upper and lower main surfaces of a semiconductor device carrying a semiconductor element. A semiconductor device ( 1 ) is provided with an insulating substrate ( 10 A), an insulating substrate ( 10 B) provided so as to face the insulating substrate ( 10 A), and a semiconductor element ( 20 ) disposed between the insulating substrate ( 10 A) and the insulating substrate ( 10 B) and having a collector electrode and an emitter electrode provided on the side opposite to that of the collector electrode. The collector electrode is electrically connected to a metal foil ( 10 ac ) provided on the insulating substrate ( 10 A), and the emitter electrode is electrically connected to the metal foil ( 10 bc ) provided on the insulating substrate ( 10 B). As a result, heat generated by the semiconductor element ( 20 ) is efficiently dissipated from the upper and lower main surfaces of the semiconductor device ( 1 ).
1. A semiconductor device comprising:
a first substrate having a first insulating plate, a first metal foil having a portion provided in a region on an inner side from ends of a first main surface of the first insulating plate, and a second metal foil having a portion provided in a region on an inner side from ends of a second main surface of the first insulating plate;
a second substrate having a second insulating plate, a third metal foil having a portion provided in a region on an inner side from ends of a first main surface of the second insulating plate, which is disposed so as to face the first metal foil, and a fourth metal foil having a portion provided in a region on an inner side from ends of a second main surface of the second insulating plate;
a semiconductor element disposed between the first substrate and the second substrate, and having a first main electrode electrically connected to the first metal foil and a second main electrode electrically connected to the third metal foil;
a terminal electrically connected to the semiconductor element and led out to the outside of the sealing resin,
a third insulating plate; and
a fifth metal foil provided on a first main surface of the third insulating plate and electrically connected to the first metal foil, wherein the terminal is connected to a second main surface of the third insulating plate and electrically connected by a wire to the semiconductor element,
a sealing resin that seals the semiconductor element,
wherein the sealing resin covers side surfaces and end surfaces of the first insulating plate on an outer side from the first metal foil and second metal foil, side surfaces and end surfaces of the second insulating plate on the outer side from the third metal foil and fourth metal foil, and side surfaces of the second metal foil and fourth metal foil, and
a main surface of the second metal foil, which is on the side opposite to that of the first insulating plate, and a main surface of the fourth metal foil, which is on the side opposite to that of the second insulating plate, are exposed without the sealing resin.
2. A semiconductor device according to claim 1 , wherein a metal member is disposed at least either between the first main electrode and the first metal foil or between the second main electrode and the third metal foil.
3. A semiconductor device according to claim 1 , wherein at least one of the second metal foil and the fourth metal foil is thermally connected to a heat dissipating body.
4. A semiconductor device according to claim 1 , wherein another semiconductor device is thermally connected to the heat dissipating body.