Semiconductor light emitting element and semiconductor light emitting device using the same
In a semiconductor light emitting device, in which a light emitting layer is formed on one surface of a conductive substrate, and an n-type electrode and a p-type electrode are formed on the same side as the light emitting layer, there has been the problem that, if larger electric power is applied, heat is generated near the n-side electrode to reduce luminous efficiency. The n-side electrode has a predetermined length at a corner portion or along an edge of the substrate to disperse a current flowing from the n-side electrode into the substrate, thereby avoiding heat generation near the n-side electrode. In this type of semiconductor light emitting element, the existence of the n-side electrode reduces a light emitting area. Therefore, the length of the n-side electrode preferably ranges from 20% to 50% of the entire peripheral length of the substrate.
1. A semiconductor light emitting element comprising:
a conductive substrate;
a light emitting layer including an n-type semiconductor layer, an active layer, and a p-type semiconductor layer, which are sequentially stacked on the conductive substrate;
a p-side electrode formed on the p-type semiconductor layer; and
an n-side electrode formed on the n-type semiconductor layer or on the conductive substrate, wherein
the n-side electrode extends in a region within 100 μm from each side of the substrate to a center along the side of the substrate, and has a predetermined length with respect to an entire peripheral length of the conductive substrate, and
the predetermined length ranges from 35% to 50% of the entire peripheral length of the conductive substrate.
2. The semiconductor light emitting element of claim 1 , wherein the n-side electrode is formed on a part of the conductive substrate including the corner portion of the conductive substrate.
3. The semiconductor light emitting element of claim 1 , wherein the n-side electrode includes a pad region for forming a bump.
4. The semiconductor light emitting element of claim 3 , wherein the pad region is disposed in a central portion of a top surface of the n-side electrode.
5. The semiconductor light emitting element of claim 1 , wherein a plated bump is formed on the n-side electrode.
6. The semiconductor light emitting element of claim 5 , wherein a plated bump is formed on the p-side electrode.
7. A semiconductor light emitting device using the semiconductor light emitting element of claim 1 .