IP Library Patent Application 12739898
Patent Application
App. No. 12/739,898

UNSATURATED POLYESTER RESIN COMPOSITIONS

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Patent No.
US None
App. No.
12/739,898
Abstract

The present invention relates to a pre-accelerated resin composition, characterized in that the resin composition comprises an unsaturated polyester resin and/or a vinyl ester resin, a soluble copper compound and a heterocyclic aromatic amine and which resin composition is essentially free of cobalt. The present invention further relates to a two component composition in which the first component comprises such a resin composition and in which the second component comprises an organic peroxide.

Claims (23)

1 . Pre-accelerated resin composition, characterized in that the resin composition comprises an unsaturated polyester resin and/or a vinyl ester resin and

a soluble copper compound, and

a heterocyclic aromatic amine, and

which resin composition contains less than 0.01 mmol cobalt per kg primary resin system.

2 . Resin composition according to claim 1 , characterized in that the resin composition comprises a heterocyclic aromatic amine according to formula 1:

in which A=N, CR; CR; and at least one of A and B is N; R, R 1 , R 2 =C 1 -C 20 alkyl, C 6 -C 20 aryl, C 7 -C 20 alkylaryl, C 7 -C 20 arylalkyl in which the aryl groups can be further substituted, and in which a ring structure can be formed between R 1 and R 2 , R 1 and R, R 2 and R and/or R 1 , R 2 and R.

3 . Resin composition according to claim 1 , characterized in that the amount of heterocyclic aromatic amine lies between 0.001 and 1000 mmol/kg primary resin system.

4 . Resin composition according to claim 1 , characterized in that the heterocyclic aromatic amine is imidazole or a derivative thereof.

5 . Resin composition according to claim 1 , characterized in that the soluble copper compound is an organic copper compound.

6 . Resin composition according to claim 5 , characterized in that the organic copper compound is a copper carboxylate.

7 . Resin composition according to claim 1 , characterized in that the amount of the soluble copper compound lies between 0.001 and 2000 mmol/kg primary resin system.

8 . Resin composition according to claim 1 , characterized in that the molar ratio copper to heterocyclic aromatic amine is between 0.5 and 50.

9 . Resin composition according to claim 1 , characterized in that the composition further comprises a 1,3-dioxo compound.

10 . Resin composition according to claim 9 , characterized in that the 1,3 dioxo compound is selected from the group of 1,3-diketones, 1,3-dialdehydes, 1,3-ketoaldehydes, 1,3-ketoesters, and 1,3-ketoamides.

11 . Resin composition according to claim 1 , characterized in that the composition further comprises an inhibitor.

12 . Resin composition according to claim 11 , characterized in that the inhibitor is selected from the group of phenothiazines, phenols, hydroquinones, benzoquinones, catechols and N-oxyl compounds.

13 . Two component composition in which the first component comprises a resin composition according to claim 1 , and in which the second component comprises an organic peroxide.

14 . Two-component composition according to claim 13 , characterized in that the second component comprises a hydroperoxide or a perester.

15 . Process for radically curing a resin composition, characterized in that the curing is performed starting from a two-component composition according to claim 13 .

16 . Process according to claim 15 , characterized in that the curing is effected at a temperature in the range of from −20 to +200° C.

17 . Use of a composition according to claim 1 , in any one of the areas of chemical anchoring, construction, roofing, flooring, windmill blades, containers, tanks, pipes, automotive parts or boats.

18 . Use of a composition obtained by claim 15 , in any one of the areas of chemical anchoring, construction, roofing, flooring, relining, windmill blades, containers, tanks, pipes, automotive parts or boats.

19 . Objects obtained by employing a composition or a composition obtained by the process of claim 15 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2010
From: JANSEN, JOHAN; KRAEGER, RONALD IVO
To: DSM IP ASSETS B.V.
Reel/Frame 024926/0532 →