Memory cell

1. A memory cell comprising:

an MOS transistor, a storage element, and a first nonlinear resistance element, those being electrically connected in series,

wherein the storage element has a nonlinear current-voltage characteristic opposite to a nonlinear current-voltage characteristic of the MOS transistor, and changes into a high or low resistance state in accordance with a polarity of applied voltage, and

the first nonlinear resistance element has a nonlinear current-voltage characteristic similar to the nonlinear current-voltage characteristic of the storage element.

2. The memory cell according to claim 1 ,

wherein the MOS transistor has the nonlinear current-voltage characteristic expressed by I=aV b (I is a current flowing through the MOS transistor, V is a voltage applied to the MOS transistor, a is a coefficient, and b is a power less than 1),

the storage element has the nonlinear current-voltage characteristic expressed by I=cV d (I is a current flowing through the storage element, V is a voltage applied to the storage element, c is a coefficient, and d is a power larger than 1), and

the first nonlinear resistance element has the nonlinear current-voltage characteristic expressed by I=eV f (I is a current flowing through the first nonlinear resistance element, V is a voltage applied to the first nonlinear resistance element, e is a coefficient, and f is a power larger than 1).

3. The memory cell according to claim 2 ,

wherein the power f is smaller than the power d.

4. The memory cell according to claim 1 further comprising:

a second nonlinear resistance element electrically connected in parallel with the storage element,

wherein the second nonlinear resistance element has a nonlinear current-voltage characteristic similar to the nonlinear current-voltage characteristic of the storage element, and has a resistance value lower than a resistance value of the storage element in a high-resistance state of the storage element.

5. The memory cell according to claim 4 ,

wherein the second nonlinear resistance element has the nonlinear current-voltage characteristic expressed by I=gV h (I is a current flowing through the second nonlinear resistance element, V is a voltage applied to the second nonlinear resistance element, g is a coefficient, and h is a power larger than 1).

6. The memory cell according to claim 5 ,

wherein the power h is smaller than the power d.

7. A memory cell comprising:

an MOS transistor electrically connected in series with a storage element electrically connected in parallel with a nonlinear resistance element,

wherein the storage element has a nonlinear current-voltage characteristic opposite to a nonlinear current-voltage characteristic of the MOS transistor, and changes into a high or low resistance state in accordance with a polarity of applied voltage, and

the nonlinear resistance element has a nonlinear current-voltage characteristic similar to the nonlinear current-voltage characteristic of the storage element, and has a lower resistance value than a resistance value of the storage element in a high-resistance state of the storage element.

8. The memory cell according to claim 7 ,

wherein the MOS transistor has the nonlinear current-voltage characteristic expressed by I=aV b (I is a current flowing through the MOS transistor, V is a voltage applied to the MOS transistor, a is a coefficient, and b is a power less than 1),

the storage element has the nonlinear current-voltage characteristic expressed by I=cV d (I is a current flowing through the storage element, V is a voltage applied to the storage element, c is a coefficient, and d is a power larger than 1), and

the nonlinear resistance element has the nonlinear current-voltage characteristic expressed by I=eV f (I is a current flowing through the nonlinear resistance element, V is a voltage applied to the nonlinear resistance element, e is a coefficient, and f is a power larger than 1).

9. The memory cell according to claim 8 ,

wherein the power f is smaller than the power d.

10. A memory cell comprising:

an MOS transistor, a storage element, and a nonlinear resistance element, those being electrically connected in series,

wherein the storage element has a first electrode, an interlayer separation film having an opening and being contacted to the first electrode, a resistance change layer being contacted to the interlayer separation film and contacted to the first electrode via the opening, an ion source layer being contacted to the resistance change layer, and a second electrode being contacted to the ion source layer,

the resistance change layer has a nonlinear current-voltage characteristic opposite to a nonlinear current-voltage characteristic of the MOS transistor, and changes into a high or low resistance state in accordance with a polarity of applied voltage, and

the nonlinear resistance element has a nonlinear current-voltage characteristic similar to the nonlinear current-voltage characteristic of the resistance change layer.

11. The memory cell according to claim 10 ,

wherein the interlayer separation film includes an insulating material.

12. The memory cell according to claim 10 ,

wherein the resistance change layer includes a rare-earth oxide, a rare-earth nitride, a silicon oxide, or a silicon nitride, and

the ion source layer includes at least one kind of metal elements of Cu, Ag and Zn, and at least one kind of chalcogen elements of Te, S and Se.

13. A memory cell comprising:

an MOS transistor and a storage element electrically connected in series with each other,

wherein the storage element has a first electrode, an interlayer separation film having an opening and being contacted to the first electrode, a resistance change layer being contacted to the interlayer separation film and contacted to the first electrode via the opening, an ion source layer being contacted to the resistance change layer, and a second electrode being contacted to the ion source layer,

the resistance change layer has a nonlinear current-voltage characteristic opposite to a nonlinear current-voltage characteristic of the MOS transistor, and changes into a high or low resistance state in accordance with a polarity of applied voltage, and

the interlayer separation film has a nonlinear current-voltage characteristic similar to the nonlinear current-voltage characteristic of the resistance change layer, and has a lower resistance value than a resistance value of the resistance change layer in a high-resistance state of the resistance change layer.

14. The memory cell according to claim 13 ,

wherein the interlayer separation film includes SiWN.

15. The memory cell according to claim 13 ,

wherein the resistance change layer includes a rare-earth oxide, a rare-earth nitride, a silicon oxide, or a silicon nitride, and

the ion source layer includes at least one kind of metal elements of Cu, Ag and Zn, and at least one kind of chalcogen elements of Te, S and Se.

16. A memory cell comprising:

an MOS transistor and a storage element electrically connected in series with each other,

wherein the storage element has a first electrode, an interlayer separation film having an opening and being contacted to the first electrode, a voltage control film being contacted to the interlayer separation film and contacted to the first electrode via the opening, a resistance change layer being contacted to the voltage control film, and a second electrode being contacted to the resistance change layer,

the resistance change layer has a nonlinear current-voltage characteristic opposite to a nonlinear current-voltage characteristic of the MOS transistor, and changes into a high or low resistance state in accordance with a polarity of applied voltage, and

the voltage control film has a nonlinear current-voltage characteristic similar to the nonlinear current-voltage characteristic of the resistance change layer, and has a lower resistance value than a resistance value of the resistance change layer in a high-resistance state of the resistance change layer.

17. The memory cell according to claim 16 ,

wherein the interlayer separation film includes an insulating material.

18. The memory cell according to claim 16 ,

wherein the voltage control film includes SiWN.

19. The memory cell according to claim 16 ,

wherein the resistance change layer includes at least one kind of metal elements of Cu, Ag and Zn, and at least one kind of chalcogen elements of Te, S and Se.